Electronics Forum | Mon Jun 25 20:54:28 EDT 2001 | davef
No, I�m suggesting an increase in the distance between the two pads on the board. This "G" in SM-782A "Surface Mount design & Land Pattern Standard" parlance. You shouldn�t fight solder balls for long periods. You should just increase the pressure
Electronics Forum | Wed Jun 27 20:01:48 EDT 2001 | mparker
Having read about your "dream", I can sympathize but gotta ask why did you feel compelled to write about this on a Sunday at noon? could it be that Chorizo enchilada with pickle sauce, downed with a jug of Ouzo on Saturday night have something to do
Electronics Forum | Thu Jun 28 22:42:13 EDT 2001 | davef
I�m with Stefan � no booze, drugs, or chewing tobacco in the shop!!! [I�d like to ban facial make-up, but am still limping from the last time I tried.] Stefan, how are you going to get the P&P manufacturers to agree on a common nozzle design, when
Electronics Forum | Sat Jun 30 14:17:53 EDT 2001 | stefwitt
I would highly recommend that you test drive your vehicle before you buy it. Buy a test kit from Topline and have a stencil made. Make an appointment with the machine manufacturer and let them know that you come with your own boards and components.
Electronics Forum | Tue Jun 26 12:24:24 EDT 2001 | nifhail
Thanx for the reply Dave. We actually had a few thermocouples attached from underneath to see if there is any delta in temperature within the same BGA's ball. They looks OK, with the slope of 1 -2 Deg C,soak at 120 Deg C - 150 Deg C at about 90 sec,
Electronics Forum | Fri Jun 29 23:10:02 EDT 2001 | Danial
Thanx for the reply guys!! The problem happened on only one PBGA, the balls are eutectic and the paste volume height is at 5.96 mil min. The stencil opening has been increased to 30 mil which initially was 20 mil. You guys are right!! One probable
Electronics Forum | Mon Jun 25 06:07:56 EDT 2001 | mzaboogie
Hello, I have a board that has been giving us problems for some time now. It is fairly well populated, mostly with IC's and SOT's on the topside. There is a Zilinx QFP160. This component does not reflow well. All of the other components look OK. A t
Electronics Forum | Mon Jun 25 09:08:22 EDT 2001 | Dave G
What type of board finish ? I've seen this same defect with QFP's on some of our HASL boards. Best I can tell either the PCB's have poor solderability or uneven pad heights due to poor solder leveling at the PCB fab. Newer PCB's seem to yield bette
Electronics Forum | Wed Jul 11 12:26:54 EDT 2001 | mzaboogie
Hi Ian, Answers to your questions: 1) PCB Pad Finishing- HASL 63/37 2)Checked a sample lot of parts. Coplanarity did not seem to be an issue. Some of the parts checked still exibited this condition after reflow. 3) There are no large ground plane
Electronics Forum | Wed Jul 11 13:41:37 EDT 2001 | procon
Hi Chris, Dave F is absolutely correct in his assunption that the leads are hotter than the pads. You must profile from the pads to see the exact temperature that they are reaching. If the entire board reflows properly as you described, don't get ca
