Electronics Forum | Wed Dec 18 15:38:59 EST 2002 | swagner
I have had a similar problem in the past, since I have never worked with a semiautomatic printer there could be a few things I recommend that will not work for you. 1. Make absolutly sure that you have proper support under all of the BGA's. 2. Print
Electronics Forum | Fri Dec 20 04:07:25 EST 2002 | Roger
Although everything that has been said earlier is sound advice for achieving good printing results, I strongly believe your problem is your manual printer and its inability to accurately control the speed at which the PCB separates from the stencil a
Electronics Forum | Sun Dec 22 06:00:54 EST 2002 | Mark
Hi: Your stencil specs are good; Did you check the stencil thickness? It would be worth a ck since there may be an error from the stencil mfr If the paste is not releasing with good stencil specs, these are possible causes: 1 The paste isn't tou
Electronics Forum | Sun Dec 22 11:02:44 EST 2002 | valuems
I am breaking a cardinal rule with this reply, but here goes. I believe almost every one is missing this one. Roger has hit the nail on the head. The gentleman is useing a clam shell printer and when the stencil lifts (too fast) and at the angle o
Electronics Forum | Wed Dec 18 19:52:25 EST 2002 | kennyg
Problem: A SMT fine pitch or BGA component needs to be baked due to MS concerns and is needed in a hurry. In some cases the packaging will not allow a high temp/short duration bake. Production will not allow a low temp/long duration bake. If the part
Electronics Forum | Thu Dec 19 11:30:11 EST 2002 | russ
What temp. are you planning on baking them? If this is long term process I would recommend that you hav trays made out of an appropriate ESDS material that can withstand your bake temp (such as duropol)for your QFPs. You can have several patterns/pa
Electronics Forum | Thu Dec 19 20:40:08 EST 2002 | jonfox
One common practice, depending on what is on the other side of the PCB and how much heat you need to draw away from the part, is to manufacture a pseudo-heatsink into the board itself. It looks like a large tinned pad but has a dense array of vias f
Electronics Forum | Thu Dec 19 20:45:47 EST 2002 | jonfox
One common practice, depending on what is on the other side of the PCB and how much heat you need to draw away from the part, is to manufacture a pseudo-heatsink into the board itself. It looks like a large tinned pad but has a dense array of vias f
Electronics Forum | Mon Dec 23 17:24:59 EST 2002 | davef
Guessing at the meaning of your description of �res., fmf, .100, 3010, 1, S�: * res - Resistor * fmf � �mf� tells you �metal film� �fmf� tells you �flame metal film� type * .100 - Precision tolerance 0.1%, although it could be power rating. * 3010 �
Electronics Forum | Mon Dec 30 01:52:13 EST 2002 | MA/NY DDave
Hi I see DaveF already gave some good stuff. You should read or at least review some of the texts he listed or some others in the same subject areas of SPC (Statistical Process Control) or DOE (Design of Experiments). I won't list the other publish