Electronics Forum | Mon Apr 12 09:09:25 EDT 2004 | russ
If they are reflowing pbfree balls to bare PCB pads they are getting that component very hot tpo melt the balls and get them to wet to the pads! I would not recommend this process at all for hightemp solder balls, for 63/37 this process is fine. As
Electronics Forum | Mon Apr 12 22:49:09 EDT 2004 | Ken
I will assume the balls of the device are tin-silver or tin-silver-copper??? There is no reason why you can not run 63-37 solder paste on this device. You will form an intermetallic at the interface structure, however, you will NOT form the 2/3 col
Electronics Forum | Mon Apr 12 22:22:01 EDT 2004 | davef
Large voids are common in via in pad [seach the fine SMTnet Archives for earlier laments], especially in blind via. Observations on your via out gassing theory: * If the copper plating on your via is GT 1 thou, there will be no outgassing from the
Electronics Forum | Tue Apr 13 13:01:01 EDT 2004 | arcandspark
These voids only appear in the solder connections that have a (via in pad). The pads that do not have (via in pad) do not have any voids. Profile is 60 seconds above 183 C and peak of 218 C. The BGA is an OMAP lead free,I am using standard eutectic s
Electronics Forum | Tue Apr 13 13:18:50 EDT 2004 | arcandspark
David F. thanks for information about the copper plating issues, I will check out the Indium site as you suggest. You are right about Thermount being Unreworkable, but T.I. makes us do it due to the cost of these RF proto types, $250 each bard board.
Electronics Forum | Mon Apr 12 10:59:49 EDT 2004 | Takfire
Hello. I have a customer that continues to have problems with their bulk cassette feeder. The customer is complaining about shorted parts that result from bulk cassette feeding operations. They are quick to claim that the failure is related to the
Electronics Forum | Mon Apr 12 22:50:46 EDT 2004 | davef
For more information on flame retardents, try these sites: * http://www.bsef.com * http://www.firesafety.org For the summary of a study into flame retardants try: http://www.surrey.ac.uk/PRC/ IVF carried out an international study on alternati
Electronics Forum | Mon Apr 12 15:52:12 EDT 2004 | wgaffubar
I am using Indium 92J type 4 solder paste due to a BGA site with .008" pads and stencil opening of .009" square and .005" stencil thickness. When I try the type 3 we get insuffecient print. The aspect ratio tells me that I should be using a type 4. T
Electronics Forum | Tue Apr 13 13:55:46 EDT 2004 | arcandspark
I have samples coming in, AIM and ALPHA, Multicore use to have manufacturing in the same town but disappeared. Your right about getting better help fro other, Indium is the worse I have ever had to deal with. They act like I am bothering them when I
Electronics Forum | Wed Apr 14 05:44:36 EDT 2004 | hun
Hi All, Just have a share with you guy. We are using T4 solder paste and also E-Stencil. We ahd try out Alpha, Kester, AIM and Qualitek. The result show Alpha had a very very heavy stack flux and can't get it clean off even by chemical
