Electronics Forum | Thu Oct 14 09:33:10 EDT 2010 | sachinnalbalwar
Hi All, Is there any way to use ROHS6/6 [Non-leaded] BGA device in Non-ROHS reflow [240 Deg C] temp. environment. I need to do this because Leaded [ROHS5/6] device I was using is obsolete and Non-leaded[ROHS6/6] drop-in-replacement part is availab
Electronics Forum | Mon Oct 18 11:43:42 EDT 2010 | hegemon
Use the forums nice search feature above. "Lead Free BGA" Lots of info. In short it seems the general consensus is that you are pretty much safe using your lead free BGA in a tin lead process, provided you run your peaks a little higher, and your
Electronics Forum | Fri Oct 22 19:34:56 EDT 2010 | hegemon
Thanks for the help guys. Nice to think I was basically on the right path. PCB manufacturer has finally conceded the barrel defects and is remaking the PCBs. We are big on pre-tinning the leads of TH connectors as well as providing some good pre
Electronics Forum | Thu Nov 04 20:49:58 EDT 2010 | eadthem
What software version and build are you using, and were you lucky enough to get a manual for it? How big are your moduals and what is your component density like? Setting up a MV3-L for IPC 3 will take a serious investment in time for a operator wi
Electronics Forum | Thu Oct 21 10:50:27 EDT 2010 | methos1979
I had a benchtop Yestech demo until for a couple weeks. It was a very good machine. I particularly liked the RGB light system which gave a good visual representation of solder fillets. There was software that allowed you to evaluate based on the p
Electronics Forum | Thu Dec 16 14:50:49 EST 2010 | rway
What Derek means is, you will have to train new templates from time to time, something you have to do with every AOI. Because there is no established method for marking parts, these markings can change. For instance, the text on chip resistors coul
Electronics Forum | Thu Oct 21 02:31:27 EDT 2010 | rok
OGER 4003C bounding to Aluminum I am hoping someone might have the solution to my problem I have the following PCB: RO4003 Thickness: .2mm Layer: top single/ bottom ground plane Finish: silver top and bottom .2um Size: 3mmx6mm I need to bound/groun
Electronics Forum | Thu Oct 21 12:44:07 EDT 2010 | swag
We issue extra parts like this: 8/2 caps and resis. - 40 over 8/4 caps and resis. - 20 over 8/4 IC's - 7 over 12mm - 7 over larger feeders + stick + matrix = the correct # req'd. These #'s were based on our first SMT lines (used equip.) and we made
Electronics Forum | Fri Oct 22 18:57:25 EDT 2010 | jry74
I am having a horrible time with the square radial lead capacitors (thru hole components) and the part coating flowing into the solder joint. These are Class 3 products. When we run them through the wave solder machine, the solder travels up the le
Electronics Forum | Thu Nov 04 04:27:46 EDT 2010 | d0min0
thanks for all the feedback... we also checked, just in case : - bake the components (no visible improvement) - bake the pcb (50% less tombstone components) - finally we changed LF paste to completely different manufacturer - and booom 0 (zero) tombs
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