Electronics Forum | Wed Oct 06 08:41:42 EDT 1999 | Dave F
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Tue Oct 05 02:31:06 EDT 1999 | Eric
| | Hi everyone, I need some help on the whole process of double sided surface mount. We have been doing surface mount for about 3 months and we're getting ready to take on our first doule sided board. I just need some step by step process regarding
Electronics Forum | Wed Oct 13 12:12:04 EDT 1999 | Bill Haynes
Hello Morris, I hope that my superiors don't see your message or they might have me go through all of that to calculate my cost per part mounted. One of the things that has helped me out considerably is an Accounting report that gives me all
Electronics Forum | Mon Oct 04 06:04:59 EDT 1999 | Joe Fields
| | What is the average pay that a SMT Programmer would get? The machines would be Fuji and Universal. | | This is going to open up a can of worms involving phrases relating to monkeys and peanuts. I have come across a spectrum of scales depending on
Electronics Forum | Mon Oct 04 10:53:48 EDT 1999 | Dave F
| What is the average pay that a SMT Programmer would get? The machines would be Fuji and Universal. | Bubba: The points made by others about company size and location are pertinent. Further, you should consider the "complete package" of salary an
Electronics Forum | Fri Oct 01 10:04:20 EDT 1999 | Andrew William Dalrymple
I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at rewor
Electronics Forum | Fri Oct 01 16:17:10 EDT 1999 | Dave F
| I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at
Electronics Forum | Fri Oct 01 06:45:36 EDT 1999 | JAX
| Hi, | | We are running 0402 component on the TCM1000 and we find that teher will be missalignment on 0402 Capositor. We have identified that the missalignment is caused by the wrong information from the vision system while doing vision centering.
Electronics Forum | Fri Oct 01 07:25:05 EDT 1999 | Wolfgang Busko
| | Hi, | | | | We are running 0402 component on the TCM1000 and we find that teher will be missalignment on 0402 Capositor. We have identified that the missalignment is caused by the wrong information from the vision system while doing vision cente
Electronics Forum | Thu Sep 30 13:37:08 EDT 1999 | Dave F
| | I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. | | What is the best way to
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