Electronics Forum | Thu May 02 07:31:00 EDT 2002 | jax
Sai, I would like to know what you base the "high drop rate" and need for special paste on. JAX
Electronics Forum | Sat May 04 21:08:11 EDT 2002 | saiwong
Special solder paste means you can't use the cheap one in low end procusts. You have to such as Multicore on the CP7. Sai
Electronics Forum | Mon May 06 20:59:38 EDT 2002 | ianchan
Hi mate, no offense intended to anyone, just wanna say that "copies" ought to be re-designed with more advanced improvements against the older models. else what the heck is that "copy-designer" team doing with all that R&D time/funding?
Electronics Forum | Tue May 14 13:54:30 EDT 2002 | saiwong
Bob, Is there anyway you can get me some QP 132��s parts. I need it urgently. Sai
Electronics Forum | Mon Apr 15 07:21:05 EDT 2002 | mamidon
Does anyone know of a No Clean solder paste that works well with RF boards. I have tried no clean in the past, and the boards have failed miserably
Electronics Forum | Mon Apr 15 09:55:45 EDT 2002 | Tom Van Heuklon
Can anybody explain breifly what some of the effects of flux residue from a no clean process might be on circuit performance? Alternatively, might you tell me where I might find such information?
Electronics Forum | Mon Apr 15 18:42:23 EDT 2002 | paulausten
Do the in/out board sensors on reflow solder machine work well? Can they be relied on or do they cause needless alarms? What has been your experience?
Electronics Forum | Mon Apr 22 18:45:07 EDT 2002 | Steve Townsend
Chances are your profile is fine. There is probably too much paste on the descrete pads. Consider reducing the aperture size of the stencil. Good luck.
Electronics Forum | Mon Apr 29 03:01:53 EDT 2002 | Bob Willis
Had a similar problem recently where there were scatered balls and voids in joints and on the surface of the joints. The paste was dispenced from a cartridge with no kneeding or mixing before printing. The result was spitting and voids. Mixed the pa
Electronics Forum | Mon May 20 16:56:24 EDT 2002 | Gary
Excess slump of paste and mis-registration can cause solder balls along with moisture. Use same date code of pcb and run with no components, paste only. Also pre-bake boards with humidity sensor in oven. If high humidity, moisture and solvent residue
