Electronics Forum | Tue Oct 29 08:41:48 EST 2002 | peterpaulmary
from my experience, no clean mean "difficult and cannot clean" Normally, you will observe white residue when cleaning it. You should study the flux in the no-clean solder cream before cleaning it. Or change no clean solder to clean type solder
Electronics Forum | Thu Oct 24 03:03:13 EDT 2002 | harriss
Hi: The component height will increase on the PCB after reflow soldering. But i don't know the accurate data of the increased height. Who can help me to get it? The stencil thickness is 5 mil we used. Thanks Harriss
Electronics Forum | Thu Oct 24 13:32:03 EDT 2002 | russ
There are many factors that will affect post soldering height. Lead shape/type, pad geometry, fillet formation, etc... You will need to measure each type of component before and after reflow. Russ
Electronics Forum | Thu Oct 24 06:01:16 EDT 2002 | Kent
I'm currently dealing with an design of an end effector that need to pick n place a BGA dead bug package. The design is using peumatic system to do the task. Any advise or suggestion on this kind of design?
Electronics Forum | Wed Jun 09 02:35:10 EDT 2004 | Bernard
Base on the PORON foam rubber recommended, is it possible to apply on small BGA chip of 4x4 ball size 0.3mm. Any specific part no and supplier for this type of foam and is it a anti-static material? Would it be possible to punch out at dia. 3mm?
Electronics Forum | Fri Oct 25 04:06:56 EDT 2002 | kcngoi
Hi Adam, Excessive heat from soldering iron will left the burn mark of RMA flux. The residue is hard to remove. Suggest to use the Flux pen for better control.
Electronics Forum | Tue Nov 05 16:21:52 EST 2002 | RicardoF
Thank you Gentlemen, that info is very useful, in fact I'm on the engineering side but I just wanted to prepare a brief description of COB process and what the requirements are. Thank you again
Electronics Forum | Tue Oct 29 22:40:45 EST 2002 | nifhail
Thank for you input. I'm using the SRT 1000 with the low air flow options. This suppose to be a good machine, rite ? cheers.. zambri
Electronics Forum | Wed Oct 30 01:23:19 EST 2002 | jasper
Normally warp max 1% of diagonal board measurement is acceptable. What's your p&p like? Some will not experience problems at all! reg Jasper
Electronics Forum | Tue Oct 29 09:01:34 EST 2002 | russ
Does anybody know of any document(s) that define the different package types such as SOP, SOIC, VSOP, TSOP,TSSOP, QSOP, LQFP, VQFP, etc...? I am re-doing our component library and would like to use industry names for each component type. Thanks Rus
