Electronics Forum | Thu Jun 26 07:20:09 EDT 2003 | emeto
Hello, What are the ways of placing underfill material under the flip chip.I read about dispensing from one side and dispensing from 2 sides. There must be other ways and I suppose some of you know them.I will appreciate any knowledge on the subject
Electronics Forum | Thu Jun 26 13:04:33 EDT 2003 | mderen
What are the handling requirments for PCB's coated with OSP? Also do most solder paste work the same with OSP or do I need to use a certain paste type?
Electronics Forum | Thu Jun 26 14:03:26 EDT 2003 | cristiano
I am looking for information about SMT machines obsolescence face to new types of components packaging like BGA�s and flip chips 0201 chips and others. I want to begin a study about industry trends that will help us to define what kind of equipment
Electronics Forum | Fri Jun 27 08:39:35 EDT 2003 | davef
It's a excellent idea to monitor the cleanliness of your components and soldering process. Consider running a spare board.
Electronics Forum | Fri Jun 27 10:48:18 EDT 2003 | Steve
We have considered running a spare board with each job as a possible solution, however due to the cost of the assembly, this would not be preferred.
Electronics Forum | Fri Jun 27 08:35:54 EDT 2003 | davef
We run a few standard recipes, because we don't like waiting for and determining if our oven has stabalized after dialing-in a new recipe.
Electronics Forum | Fri Jun 27 08:32:08 EDT 2003 | davef
You should be fine. A fifteen percent reduction of these pads will probably improve reliability, depending on spacing of course.
Electronics Forum | Fri Jun 27 10:04:55 EDT 2003 | Charlie Finke
Does anyone know of a good web site that lists general package dimensions for various SMT device sizes, like 1206, etc.?
Electronics Forum | Tue Jul 01 07:12:12 EDT 2003 | iman
actually, component sellers will have their own respective catalogue with all the available sizes used in their industrial business. Try your local "Rohm/Murata" sales-rep. for starters in the realm of chip components.
Electronics Forum | Wed Jul 02 06:56:34 EDT 2003 | davef
There's nothing wrong doing about adding a dessicant. You'll need to: * Seal the bag. [you may end-up needing a moisture barrier bag] * Select a dessicant packaging that is ESD dissipative.
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