Electronics Forum | Fri Sep 10 11:27:18 EDT 2004 | rlackey
Hi John, We use Spray mount adhesive on durastone pallets, then kapton tape on the egdes. We have produced upto 25K flexi PCB's a day with this method. The trick is to get just the right amount on the pallet, to maintain tackiness. Cheers, Rob.
Electronics Forum | Sun Jun 27 02:23:52 EDT 2004 | mskler
Yes,immediatly means after three days of the SMT production.Actually we are using o clean heraeus Solder paste with 2%AG. The contamination is 90.5%.We are not using any extra flux.
Electronics Forum | Sat Jun 26 14:15:28 EDT 2004 | PCA
Does any one have the best recommendation for a water soluble solder paste for use with fine pitch parts and micro BGA's and immersion gold pads.
Electronics Forum | Sat Jun 26 15:28:51 EDT 2004 | gmoms
Can anyone recommend a low end ERP/MRP system that they have found works well in a contract electronics manufacturing environment in a small size operation ?
Electronics Forum | Tue Aug 31 13:16:23 EDT 2004 | GS
Hi Davef, if by using Omegameter 600 SMD I am reading 1,56 microgram NaCL/sqcm, what is the real value I am measuring? considering the 14 sensitivity ?
Electronics Forum | Mon Sep 06 08:38:44 EDT 2004 | davef
You're correct GS. Your's is a good cautionary tale for all NC flux users. Unfortunately, it's too easy to assume that boards and components are clean, even if our NC process is flawless.
Electronics Forum | Wed Sep 15 17:13:53 EDT 2004 | GS
Do anyone of you know if are there any Standard (IPC, JEDEC, etc) telling how much can be the acceptable level of TIC (ugr/cm2 NaCl equivalent) allowed on surace of Connectors, Components,before to be assembled on PCB ? Many thanks Rgds GS
Electronics Forum | Mon Jun 28 08:25:54 EDT 2004 | Scott Dodge
What is the difference between a smooth finish organic coated bare copper board for fine-pitch components and HASL finish?
Electronics Forum | Mon Jun 28 09:15:21 EDT 2004 | jdumont
Morning all, we have been seeing some problems with the edges of some of our BGA's curling away from the PCB after reflow. Is this possibly a moisture problem? If so what would be a good time/temp to bake them at to rectify the problem? Thanks in
Electronics Forum | Mon Jun 28 10:04:41 EDT 2004 | jdumont
Yes please send a copy of that paper as I dont have access to the 033 STD. That would be great, thanks a lot. jdumont@astromed.com JD
