Electronics Forum | Tue Nov 01 11:47:54 EST 2005 | jasont
Hi, Please let me know if you know who supports Printek II semi-auto screen printers in Canada, USA. I have tried to find them on web but lucked out. Thanks, jason@tekmart.com
Electronics Forum | Tue Nov 01 13:43:57 EST 2005 | jasont
transition automation no longer supports; please advise me who can support this TA PrinTEK II in Canada area.
Electronics Forum | Wed Nov 02 20:27:08 EST 2005 | davef
Why stop at fids: * IPC-2221 - Generic Standard On Printed Board Design * IPC-2222 - Sectional Design Standard For Printed Board For Organic Printed Boards
Electronics Forum | Thu Nov 03 13:09:30 EST 2005 | erokc
Davef, pardon my ignorance. Where is and who is IPC. http://www.ipc.com is a financial institute. Please lead the way Dave
Electronics Forum | Thu Nov 10 20:14:44 EST 2005 | davef
FREE DOWNLOAD - SMEMA3.1 - Fiducial Mark Standard http://webvision.ipc.org/scripts/mgrqispi.dll?APPNAME=IPCWEB&PRGNAME=TOCFRAME&ARGUMENTS=-N,-N,-A,-A,-N50
Electronics Forum | Wed Nov 02 03:35:09 EST 2005 | Slaine
I thought it was the tin content that leached the copper so presumed 100Sn would be more aggressive?
Electronics Forum | Thu Nov 03 04:31:21 EST 2005 | arnold
davef, how can you convince me that 100Sn dissolved copper much faster?
Electronics Forum | Thu Nov 03 07:22:16 EST 2005 | davef
arnold: I did not say that Sn100 dissolved copper faster. The graph of dissolution rates [from the link above] shows that Sn100 dissolves copper slower than many of the other solders.
Electronics Forum | Thu Nov 03 13:35:46 EST 2005 | Amol
the copper forms intermetallics with tin to get Cu3Sn and Cu6Sn5. thus intermetallics formation consumes Cu and depends upon the cooling rate, faster the cooling rate, lesser the intermetallic formation
Electronics Forum | Wed Nov 02 07:37:13 EST 2005 | Kathy
We just got these, and they seem to work great for screen printing. I know many people use them for printing, but has anyone tried them for other processes such as placement?
