Electronics Forum | Thu May 26 17:45:36 EDT 2016 | stevedc
Thanks for the thoughts. I will try a few things tonight so see if I can clean anything from the windows. As always, thanks for your thoughts and time :) BR, Steve
Electronics Forum | Fri May 27 09:27:56 EDT 2016 | bobpan
Glad I can help....if you have any other questions...go to my web page @ www.precision-repairs.com Bob
Electronics Forum | Fri May 27 04:31:56 EDT 2016 | leeg
We have recently had a jig get caught in the chain of the flowsolder machine, causing the board to delaminate, is there any hard and fast rules as to if the area needs evacuating due to fumes, and if the air quality has to be checked before allowing
Electronics Forum | Fri May 27 13:20:06 EDT 2016 | elton111
how are you. I have a problem with a table that the issue errori topaz. The issue is the message "Bring back component." a problem with the pick up parts vacum setting level is 100 and the current 111 with vacum head is 6. Can u tell me how to Calibr
Electronics Forum | Mon May 30 20:17:54 EDT 2016 | jasltd
Hi Folks, I'm having issues with our dek Galaxy which is randomly having and reporting the error CAN Node Not Responding. Has anyone seen / fixed this error before?
Electronics Forum | Wed Jun 01 22:42:50 EDT 2016 | dinhhuunam
CAN Node Not Responding This problem can be caused by either: 1. Faulty Node 2. CAN bus cable disconnected. 3. No power to CAN Node.
Electronics Forum | Thu Jun 02 08:45:41 EDT 2016 | emeto
If it is intermittent it is definitely cable or connector. Check all connections first and if not, replace the cable that is moving/bending.
Electronics Forum | Wed Jun 01 14:58:45 EDT 2016 | claudea2
I answered my own question. The nozzle changer was in the left front, moving it to the left back fixes the problem.
Electronics Forum | Wed Jun 01 22:54:18 EDT 2016 | sevenghost
Hi everyone, is there any sales representative or sales office in Philippines for Vi Technology? because i can't find one in their website
Electronics Forum | Wed Jun 01 23:09:46 EDT 2016 | slouis2014
Hi, can anybody give an idea how to lessen the void on a double ground pad IC. I have tried to change the stencil design, change the solder reflow setting. but i still haven't reach 75% solderability. thanks alot
