Electronics Forum | Mon Feb 28 08:18:03 EST 2000 | Engineer
I'm currently researching new rework equipment, and was wondering if anyone had any recommendations. We currently have an older PACE hot air system that has had mixed results. It tends to overheat the board and IC. Is the IR any better, or has hot ai
Electronics Forum | Sat Feb 26 09:22:19 EST 2000 | Dave F
Jason: Assuming you wantto reuse the TSOPs, two things come to mind: 1 Don't bend the leads. This can be caused by not melting the solder on all leads at the same time. 2 Don't break the body. This can be caused by moisure absorbed by the case ex
Electronics Forum | Fri Feb 25 16:23:10 EST 2000 | Russ
Assuming that you need information such as the type and size of screw to the recommended torque value. I have found great information from the torque tool manufacturers themselves! There is an ANSI spec but I don't know the specifics. Your torque d
Electronics Forum | Fri Feb 25 05:42:17 EST 2000 | Istv�n Dominik
Hi, We should wavesolder a PLCC44 package. The PCB is under the design procedure now and we must specify the best parameters (the orientation (45 or 90 degrees) of the package on the PCB,the number, the positon and the size of the solder thief pads
Electronics Forum | Fri Feb 25 16:04:18 EST 2000 | Dave F
Sze-Pei: Are talking BGAs here? Flux type? Profile? Pad material? Aperture size? We won�t want to give people too many hints on what the problem is would we? BGA voiding is a function of materials, methods, environment, and human factors. Con
Electronics Forum | Thu Feb 24 21:47:22 EST 2000 | Dave F
Interesting, Gary. Try this: 1 Assess candidate solders by reviewing J-STD-006 (http://canfieldmetals.com/j-std006.htm) to determine solder formulations that have liquidous temperatures in the desired range. 2 Request recommended profiles from supp
Electronics Forum | Thu Feb 24 14:58:11 EST 2000 | Greg denham
Does anyone have any information on baking boards to remove moisture before reflowing and waving assemblies? I've been told that we should do this to stop such problems as delamination of boards, blow holes, solder balls, etc. I don't know have any e
Electronics Forum | Thu Feb 24 18:08:42 EST 2000 | Travis Slaughter
Baking boards, especially multi layer, will help with blowholes and delimitation, but not with solder balls. Normally about 120c for 1 hour or so is sufficient. I usually will not go to this trouble unless a board has proven to be a problem or if th
Electronics Forum | Fri Feb 25 10:23:46 EST 2000 | K3 Equipment
Greg, If you are having a problem, i would first check board manufacturers process. Also are they shipping boards to you in seal packages (a must if you are in a humid part of the country.) Most of the time with a few simple process controls moistur
Electronics Forum | Mon Feb 28 17:16:38 EST 2000 | Stu Leech
We just got a lesson on the effectiveness of heat sealed metalized vapor barrier bags. A customer sent us two bags of 100% saturated PBG components by air freight. This was for a demoisturizing test. When we found the devices 80% dry when they arrive
