Electronics Forum | Mon Jun 18 16:13:47 EDT 2001 | calipso
If a PCB is already going through ICT and some additional inspection method is desired to increase first pass test yield rates, what are the advantages/disadvantages of AOI vs XRay? The most common problems seen are missing or skewed components and i
Electronics Forum | Mon Jun 18 16:48:00 EDT 2001 | Gil Zweig
We have found a significant number of PBGA problems associated with physical deformation of the package. Deformations such as dishing (potatoe chipping) and delamination under the die (popcorning). These can be detected by x-ray by the variation patt
Electronics Forum | Mon Jun 18 21:46:27 EDT 2001 | davef
It's possible that combining these two fluxes is benign, you sure can't say your customer is wrong, can you???? So, what is the intent of leaving these two different flux materials on your board? What is the residue remaining on your board as your
Electronics Forum | Wed Jun 20 11:28:45 EDT 2001 | Steve
Fluxes that have been properly heat activated are insulative (non-reactive) during operation in the field and during environmental testing. If you are also performing a cleaning operation, the possibility of growing dendrites is so remote that it can
Electronics Forum | Tue Jun 19 18:15:22 EDT 2001 | davef
What do you mean when you say "structure"? Taking a different tact to get at an answer to the original question, if applications such as general, BGA attach, and die attach inspection require a resolution of 10 units. What would you suggest are the
Electronics Forum | Mon Jun 18 19:37:02 EDT 2001 | Gil Zweig
You can use your x-ray inspection system to QC incoming multi-layer printed circuit boards. In particular you would want to insure drilling registration. A drilled, plated through hole, precipitously close to a ground plane can have , in time, copper
Electronics Forum | Wed Jun 20 16:03:01 EDT 2001 | Gil Zweig
The multi-layer printed circuit board manufacturers have been using x-ray inspection for many years to quality control drilling and lamination of multi-layers. Assemblers should consider using x-ray for incoming quality control from their multi-layer
Electronics Forum | Mon Jun 18 19:22:38 EDT 2001 | Gil Zweig
Dave; See my answer to "Alternate to X-ray" The combination of endoscope optical inspection with x-ray inspection provides the most effective means of BGA inspection. Transmission x-ray provides a very rapid means of qualifying then process control o
Electronics Forum | Mon Jun 18 22:28:28 EDT 2001 | davef
Hey, howcum yins are running the OnBoard Forum some 93 moise clicks away er there abouts? Last time there was an ONBoard [Orboramic, er something or other, yano AOI guys.], yins had a nice blue bar no the main forum page that we-ins could make drop-
Electronics Forum | Tue Jun 19 13:49:08 EDT 2001 | Ben Brandt
Hello everyone. I'm trying to locate (if it exists) an impact sensor (which would activate if hit or jarred) on some sort of roll form with 2 leads which could be easily placed and soldered through automation. If anyone knows of a supplier, I would v
