Electronics Forum | Fri Aug 10 02:30:46 EDT 2001 | praveen
Hello Friends, Please advise how critical is the Micro BGA baking? The BGA size is around 7x7mm and we need to program it before mounting. The Micro BGA's are supplied in Trays and are put in to tape and reel after programming.We need to put these BG
Electronics Forum | Fri Aug 10 13:09:49 EDT 2001 | Hussman
Hey Wister, Assuming you are talking about BGA voids, and you just want to try and optimize your profile, you could try a "straight ramp profie". This is where the soak temp is constantly being elivated until you hit reflow. I find this helped me
Electronics Forum | Wed Aug 15 13:25:50 EDT 2001 | seand
Hello Jean, You may want to try QWIK-Trace out of Scottsdale, AZ. They can perform etch cuts as well. I am a local representative for Qwik Trace and would be happy to discuss your application. If you have any questions, you can reach me at 480-82
Electronics Forum | Tue Aug 14 17:09:37 EDT 2001 | davef
Dano's confused. The boards are delaminating during soldering. The delamination just isn't immediately appartent after soldering. Stepping backwards. It's remotely possible that if the boards were blistering hot from soldering and then dumped in
Electronics Forum | Tue Aug 14 21:42:13 EDT 2001 | davef
2% silver will be a little shinier. [Some inspectors hate that.] After that differences get murkier. Some people believe that 2% silver does something er other to scavange gold and silver to produce a less brittle connection. We have never seen ev
Electronics Forum | Wed Aug 15 05:19:14 EDT 2001 | hardy boy
Hi, I have a fine pitch QFP (TQFP100) and after reflow soldering, i got less solder ( not enough fillet) on the toe area but have good fillet at the heel. Does this mean that I have a weak solder joint or is my process not too good ? What is importa
Electronics Forum | Wed Aug 15 08:05:44 EDT 2001 | wbu
Oh boy, I prefer the fillet at heel of course, the toe you can�t trust. The solderable finish of the leads is applied and than the leads are cut leaving the toes without this so much loved finish. guess how that looks after you�ve finished your job.
Electronics Forum | Wed Aug 15 16:08:02 EDT 2001 | davef
A properly formed solder connection is stronger than the underlying copper to laminate bond. Measuring pad peal strength: IPC-TM-650, Method 2.4.21 for multiple solderings, use Method 2.4.8 for copper peal using an Instron machine. Typical requiremen
Electronics Forum | Wed Aug 15 16:36:06 EDT 2001 | sharafali
How is a squeegee considered damaged? Is just a bent blade sufficient to call it 'unfit for use'. How much bend, in a blade may be considered unfit? How much do dents on a blade affect squeegee perfomance? what is the effect of blunt blades on print
Electronics Forum | Wed Aug 15 17:30:43 EDT 2001 | peterson
Hello All, We have an MPM 2000 screen printer. My question is this: we are having a stencil made that has both top and bottom side on a single foil. Our Process people are unsure if the machine parameters will allow it. The board size is 19x15. Can i
