Electronics Forum: viewing (Page 4236 of 7890)

No wetting on connector latches

Electronics Forum | Thu Sep 02 05:12:15 EDT 2004 | doi

I am using a triad connector and have problem with wetting at both connector latches.Observed that the leads have very good shiny wetting however concerning the latches the solder just seem to disappear to thin airafter reflow.The connector has a gui

No wetting on connector latches

Electronics Forum | Thu Sep 02 09:51:53 EDT 2004 | davef

We see latches from some suppliers that just are not solderable. Usually the nickel plate on the latch is poor, allowing the nickel to corrode, and requiring a more active flux [if you're lucky]. But lots of times, you end-up with partial wetting,

MSD Control

Electronics Forum | Thu Sep 02 11:00:14 EDT 2004 | diderry

Hi Bryan, I hope you dont mind a quick sales pitch here. We have developed a system called HumiTel which is used to manage MSDs. Its not the paper tracking system you mentioned; it comes in two flavours, a hardware tracking device and a software whic

About IR Basics

Electronics Forum | Thu Sep 02 14:51:28 EDT 2004 | Jovy

Hi All, I Need to know What is the main Concepts and Basics to Use IR in Soldering BGA & mBGA Ics, for Example - what are Range of Heating Temperatures - What is the Preheating means !? - What is the best Heat/Time Curve Ive to care about while using

About IR Basics

Electronics Forum | Thu Sep 02 22:39:58 EDT 2004 | davef

Comments are: * Few of us use IR reflow. It has been replaced by convection or a combination of convection and IR. * Follow the recommendations of you paste supplier in determining the initial thermal recipe for your oven. * Look here to learn more

Looking for Filled via -- Embedded within pad - criteria

Electronics Forum | Thu Sep 02 22:23:44 EDT 2004 | davef

Dunno about something formal. After you specify your hole size and fill material, why not say something like: " Surface to be planar prior to final plating and metallization. Boards must be suitable for via in pad technology." We do not allow plati

Ion exchanger

Electronics Forum | Mon Sep 06 09:00:27 EDT 2004 | davef

There is distilled water and distilled water. It depends on the distallation process used. Using distilled water is fine, as long as it meets your standard. So, if you buy distilled water, get a written certification that conductivity is less than 1

Gold contamination: MOSFET lead pre-tinning

Electronics Forum | Thu Sep 02 18:39:48 EDT 2004 | steveg

We're having a lot of problems with failed solder joints to gold-plated MOSFET leads. Gold plate thickness spec is 60uin, but we've seen as much as 200uin in cross-section, so we're obviously concerned about gold embrittlement issues. Pre-tinning w

MLCC crack detection

Electronics Forum | Mon Sep 06 04:42:18 EDT 2004 | KenF

Thx for the replies. Acutally I am doing a process related study to see whether the process (pcb depanelling)can induce crack to an MLCC. After depanelling, I will do a thermal shock on the MLCC based on IEC 384-1, that is, five cycles of 30min at hi

measument of paste thickness after Screen Printing

Electronics Forum | Tue Sep 07 09:53:37 EDT 2004 | rob

Hi Dhanashekar, I'm with Chris on this one, unless you are carrying out 0201 or ultra fine pitch placement it's a helpful but not critical tool. We found most print errors were avoided using the 2D vision on the printer, combined with plenty of aut


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