Electronics Forum: viewing (Page 5216 of 7890)

Re: VOC free flux

Electronics Forum | Wed Apr 19 16:03:58 EDT 2000 | Steve Harshbarger

David, Your concern is legitimate regarding the aggressiveness of VOC free flux. Water (the main substance of VOC free flux)is much more aggressive than alcohol. You will have an increased need to be more cautious from a compatibility standpoint, r

Open v.s viscosity

Electronics Forum | Tue Apr 18 08:05:00 EDT 2000 | Wister

Hi, I got an interesting result after completing DOE that more open defects occurred higher the viscosity.The ppm would be 500 while the viscosity is 950 and it would be 1500 while the viscosity is 1050.The range of viscosity is 900 ~ 1100kcps. The p

Re: Convection Oven and thermo profiling of Circuit Boards

Electronics Forum | Mon Apr 17 19:54:39 EDT 2000 | Dave F

Sounds like a true IR guy to me!!! Your profile should reflow solder on the board properly to produce a reliable product for your customer. If that requires more than one proifile, so be it!!!. That being said, we went from hundreds of IR profiles

Re: Convection Oven and thermo profiling of Circuit Boards

Electronics Forum | Wed Apr 19 10:52:29 EDT 2000 | Arturo

Russ: you could divide your 600 in let's say 10 or more categories,category #1 could be the thinnest thickness and smaller board size and smaller components;category #2 thinnest thickness smaller board size and mixed small and big components; and so

Re: Convection Oven and thermo profiling of Circuit Boards

Electronics Forum | Wed Apr 19 18:02:34 EDT 2000 | Mike Flori

If you can divide your boards into different categories it allows you to determine a different starting profile for each category, based on size, # of layers, etc. When you get a new board to profile you'll have an idea what settings will get you clo

Re: Convection Oven and thermo profiling of Circuit Boards

Electronics Forum | Mon Apr 24 14:08:19 EDT 2000 | Finepitch Services

My agreement with all this started by Arturo's message... Just as a reminder, I guess he suggested to have still "one profile per board" which I completely agree... So, Board #(1,600) could be using a Recipe #(1,10) but it should still be saved as

Re: Convection Oven and thermo profiling of Circuit Boards

Electronics Forum | Tue Apr 25 22:59:59 EDT 2000 | armin

If I were you, I would divide my boards into categories...and I'll categorize them by their components e.g. Bds with BGA, with QFP, Bds. with plain chip components...and so on...this is to create a recipe for each components with QFP's, BGA's etc...t

SMT leadless component solderability finishes

Electronics Forum | Mon Apr 17 16:17:47 EDT 2000 | Dennis Fall

Typically, Sn/Pb solders are used to preserve solderability on leaded and leadless SMT components. Are other finishes (such as those used in PCB manufacturing e.g. Sn, NiAu, OSP's, etc.) frowned upon by PCB stuffers and their customers? I am intere

Solder Mask repair

Electronics Forum | Fri Apr 14 19:09:38 EDT 2000 | Ashok Dhawan

One of our customer insist on repair of solder mask even if it is pin holes or less than 0.010 sq in. area. Based on our knowledge bank, we though of thre options, there could be many more. 1. coat the exposed area with original solder resist (from

Re: Converting to 'No-Clean' process

Electronics Forum | Mon Jun 19 16:59:07 EDT 2000 | D.A.Munro

We use both Nc and Ws at wave and reflow, Nc is less forgiving and the board topside must reach aprox.110c prior to wave to be fully activated. Your application of the flux is even more criticale,it's not very agresive for one thing and apply to much


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