Electronics Forum | Tue Nov 28 20:11:39 EST 2000 | Dave F
Yes, it makes sense that company peculiar issues should not be included in a general training program, but say the issue delt with: * Course indicating [through correct responses to testing] that component leads should not be handled because it could
Electronics Forum | Wed Nov 29 08:33:05 EST 2000 | Dave F
No, the specific question is on the "Soldering & Rework" disk. Yours is a good approach to updates. [No lakeside baronal mansion, eh???] I have sent a list of unusual questions to Evelyn that includes the above example. It's difficult to document
Electronics Forum | Tue Nov 28 11:31:25 EST 2000 | Deon Nungaray
Hello Robert, As we are all aware the lead-free movement has been somewhat popular lately. We have had in depth discussions about materials, processes and procedures. How about training or re-training? I believe this would be one of the biggest chal
Electronics Forum | Mon Nov 27 12:22:52 EST 2000 | rabell
You might want to check with Atlas Copco re the characteristics of the tool case. Although it is plastic, it could have been formulated to be dissipative. Unfortunately, with power tools there is always the conflict between the need to isolate the
Electronics Forum | Mon Nov 27 11:22:37 EST 2000 | Dave F
Please benchmark training given by electronic board assembly companies according to: * Style (eg, classroom, OJT, off-site, etc) * Type (eg, job, safety, environmental, quality, etc) * Size of company (eg sales, GT $500M, LT $500M but GT $50M, LT $50
Electronics Forum | Thu Oct 26 18:10:11 EDT 2000 | ptvianc
Philip: Cases 1-3, those criteria may be specified in more recent versions of ANSI/J-STD-001 and/or ANSI/IPC-A-610. Unfortunately, I do not have any new versions of these specs. that may cover these points. As for voids in BGA joints, I have not
Electronics Forum | Thu Oct 26 16:38:08 EDT 2000 | Philip A. Reyes
Hi Sir Charles! Good Day! I hope you can help me about my queries. 1. What is the acceptable misregistration or misalignment of balls after reflow soldering of PBGA module on the PCB? 2. Is there any criteria for solder ball defect or solder beads
Electronics Forum | Thu Oct 26 09:26:32 EDT 2000 | ptvianc
The book is available through the American Welding Society as well as through the Surface Mount Technology Association bookstore. The contact information is listed below: American Welding Society 550 N.W. LeJeune Rd. Miami, Florida 33126 Phone: (80
Electronics Forum | Tue Sep 19 14:40:13 EDT 2000 | Erick Russell
It is always a good idea to heat the entire board to 100C to 140C prior to reflowing the site to be reworked to reduce warp and localized stress. (Thermal uniformity of the preheater is key here). For a BGA, the laser is programmed to heat only the
Electronics Forum | Wed Sep 20 09:02:24 EDT 2000 | Erick Russell
The programming is simple and is based on just a few simple parameters. There is no CAD interface required to program the equipment. You must key in the dimensions of the component (X-Y and Thickness) and then specify the required thermal process.
