Electronics Forum: viewing (Page 5256 of 7890)

Who can recommend a reliable solder volume measurement m/c?

Electronics Forum | Wed Sep 12 18:08:15 EDT 2001 | davef

I missed the laundry part [but then again, I couldn't figure-out that "AMT" as THE typo] That aside, I have no problem with what Cyber said. Continuing, we have talked about all of the following issues in previous threads on SMTnet: * LSM 300 does

BGA rework profile help

Electronics Forum | Wed Jun 06 09:09:28 EDT 2001 | nwyatt

Help! I have been assigned to take over our current rework machine because the profiles have been changed so often and by so many people that they are now not working consistantly. Nobody has been supporting it for the past 2 years and now I have b

BGA rework profile help

Electronics Forum | Wed Jun 06 10:59:43 EDT 2001 | wbu

It�s hard to tell you one good profile for a specific machine cause profiles are mainly dependent on the specific assembly you want to rework. My aproach to this problem is trying to get a close as possible profile as under normal reflow conditions u

BGA rework profile help

Electronics Forum | Wed Jun 06 13:38:15 EDT 2001 | Michael Parker

To expand on Wolfgangs reply, I suggest you contact your local SRT rep. We recently had the same type of problem as yourself. This is the path we followed. Arrange for operator training, for yourself first, then the operators after you get the machi

BGA rework profile help

Electronics Forum | Wed Jun 06 20:25:06 EDT 2001 | davef

Good machine, good people; yer just about there. Look here for help: http://www.mot.com/SPS/PowerPC/teksupport/teklibrary/papers/BGA_AssemblyRework.pdf http://channel.intel.com/design/quality/component/rework_socketprofiles.htm Earl Moon, a depart

Can local fiducials improve BGA placement?

Electronics Forum | Wed Jun 06 16:51:06 EDT 2001 | jax

Unless your placing micro-bga, board edge fiducials on alternating corners will provide more than enough placement correction ( Micro-bga's should also be fine depending on how your equipment maps the board ). The part data and vision recognition nee

Can local fiducials improve BGA placement?

Electronics Forum | Thu Jun 07 07:11:41 EDT 2001 | stefwitt

8" ). For calculation of the theta angle, the global fiducials should be placed over the diagonal. Component recognition can be improved if your vision system has different light zones. The steep light should be turned off and the flat light turned

No-Clean or water

Electronics Forum | Fri Jun 08 08:53:08 EDT 2001 | onset

Hi our company is currently using a water soluable paste. We have heard that no-clean solder paste has gotten alot better over the years and are thinking about making the switch. Our main concern is that our solder joints will not look as good as t

No-Clean or water

Electronics Forum | Fri Jun 08 21:52:58 EDT 2001 | Katrina

Hi, This is Katrina speaking from ShenZhen,P.R.China. Hi, Jack Our company SELP(a member of CIPC) is a representative of some leading manufacturers in US and EUC,such as SEHO GmbH and Heraues.There are some typical No Clean/Non-halid paste from He

Pallet absorb thermal heat : compensate by higher deg-C?

Electronics Forum | Sun Jun 10 12:30:10 EDT 2001 | procon

Is this a Convection Oven or IR? If convection, you can increase the air velocity in the zones if the oven has this ability. You should do as Dave has explained. If you must use pallets when reflowing your components, you need to profile in the same


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