Electronics Forum | Thu Apr 09 22:50:50 EDT 1998 | Larry
Configuration of our HP 3065 in-circuit tester: HP3065 HL testhead with CL+ controller with 2 hard drives and tape drive 11 Hybrid cards 4 Analog cards 1 GP relay card 2 DUT power supplies (6038A) 1 HP color terminal (2397A) 2 HP terminals (700/92 an
Electronics Forum | Mon Apr 20 10:20:37 EDT 1998 | Joyce Hughes
| | Configuration of our HP 3065 in-circuit tester: | HP3065 HL testhead with CL+ controller with 2 hard drives and tape drive | 11 Hybrid cards | 4 Analog cards | 1 GP relay card | 2 DUT power supplies (6038A) | 1 HP color terminal (2397A) | 2 HP t
Electronics Forum | Thu Apr 09 18:36:52 EDT 1998 | Steve Gregory
| Has anybody heard of a shield to shield the cutter from | flying leads during hand cutting of through hole components. | If it collected the leads also that would be helpful. | I am thinking of plexiglass or something that the board | could be plac
Electronics Forum | Thu Apr 09 18:02:03 EDT 1998 | Ron Beasley
| Has anybody heard of a shield to shield the cutter from | flying leads during hand cutting of through hole components. | If it collected the leads also that would be helpful. | I am thinking of plexiglass or something that the board | could be plac
Electronics Forum | Thu Apr 09 20:10:28 EDT 1998 | Kathy Palumbo
| Can anybody tell me what to do with IC tubes when we are | done with them? Plastics companies want tons and we only | generate about one hundred pounds a month (guess). We | have been throwing them out... I got the recycling company to drop off
Electronics Forum | Fri Apr 10 13:25:21 EDT 1998 | Jon Medernach
| Is there a good way to inspect BGA | balls ? Is there an inspection piece | of equiip.? The idea is to develope a process that eliminates insoection. BGA's, by the nature of the design, do not lend themselves to inspection. Even X ray is subjec
Electronics Forum | Thu Apr 09 14:08:10 EDT 1998 | Mike C
A few months ago there was a thread here concerning shorts under ceramic 0805 Caps. I was wondering if the source of the problem was ever found. I have had the same problems in the past, unfortunately the problem went away as fast as it came up. A
Electronics Forum | Thu Apr 09 12:33:43 EDT 1998 | Earl Moon
| I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to wheth
Electronics Forum | Thu Apr 09 00:07:54 EDT 1998 | Bonnie
I am in urgent need of a pcb land patten (footprint)for this device. I have the component data sheet with with package dimensions from Motorola, but they do not include the recommended land pattern. I requested a patten over a week ago, but have no
Electronics Forum | Thu Apr 09 00:12:02 EDT 1998 | Bonnie
| I am in urgent need of a pcb land patten (footprint)for this device. I have the component data sheet with with package dimensions from Motorola, but they do not include the recommended land pattern. I requested a patten over a week ago, but have
