Electronics Forum: viewing (Page 5531 of 7890)

Why measure O2 ppm level in N2 environment

Electronics Forum | Wed Mar 05 08:12:56 EST 2003 | nifhail

Hi Mike, How do we measure the O2 ppm in N2 environment. I don't understand why the customer keep insisting me to use N2 instead of Air. I don't see the need for it as I done have any soldering issue. Can you share with me why N2 is needed at the fi

PCB Bake

Electronics Forum | Wed Mar 05 10:59:04 EST 2003 | jfb2003

Currently, my company's applies a PCB bake (5 hours @ 125C) for all SMT PCB's prior to surface mount assembly. Many of us believe this is a non-value added activity, and have concluded it can be eliminated. With today's PCB process controls coupled

PCB Bake

Electronics Forum | Wed Mar 05 11:54:44 EST 2003 | ruggi

Hi JFB, I think this is an unnecessary activity, but it may depend on your RH. We are in the Spokane, WA area, and the RH avg year round is about 25-30%. We have never baked our PCBs in the 9 years I've been here across 800+ varieties, including

Immersion Gold over Nickle de-wetting problem

Electronics Forum | Thu Mar 06 22:34:55 EST 2003 | davef

O' Connor: Are you saying that: * You solder fine in the areas where you print paste * You solder poorly in the areas where you don't print paste Aside from that, the gold on these pads seems to be less bright than previous lots. [if that's not it

Immersion Gold over Nickle de-wetting problem

Electronics Forum | Sat Mar 08 21:45:59 EST 2003 | MA/NY DDave

Hi The other thing the Ni does is to create a time barrier for the underlying copper (Cu) migration into the joint. Degradation still occurs yet it is slowed significantly. Diffusion Equations under, electonic current pressures across time, are inv

Immersion Gold over Nickle de-wetting problem

Electronics Forum | Mon Mar 10 15:20:41 EST 2003 | MA/NY DDave

Hi Well I don't have all the titles right handy, yet let me give a few places for you to check. All my books aren't exactly at my finger tips. Author: Tumalla (??spelling) He is now at Georgia Tech Author: Lasky, Seraphim Author: Ning-Cheng Lee or

SPC for SMT

Electronics Forum | Thu Mar 06 18:21:29 EST 2003 | ppwlee

Mike, What is the most common method for monitoring and calculating machine capability for: - Reflow oven, I currently run a carrier monthly to monitor its temperature profile and would like to simplify the process. - P&P machines: We don't have a

Terms and Conditions for Built-to-Print Jobs

Electronics Forum | Fri Mar 07 14:48:34 EST 2003 | gdstanton

Pretty much everything under the sun. For example if Company A wanted to hire Company B to build printed circuit cards designed by Company A; What type of T & C might Company B seek in their contract/agreement with Company A? The following things c

AOI, Pre or Post Reflow?

Electronics Forum | Tue Mar 11 12:43:27 EST 2003 | MA/NY DDave

Hey Frank, We got lucky. An article just appeared in one of our industry's magazines. Now you still have to read these articles carefully since the proponents sell the equipment yet it does support both opinions. Except it says (before PnP) and (p

TOMBSTONE DEFECTS

Electronics Forum | Thu Mar 13 15:22:47 EST 2003 | ruggi

Ditto on the profile/reflow oven...a couple years ago, we had a huge increase in the number of tombstones found post-reflow. Profiling the oven showed a decent curve with some innocuous minor deviations, and further investigation of the oven found 2


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