Electronics Forum | Wed Sep 15 17:50:24 EDT 2004 | GS
Hi Simon, do not forget BGA have more surface contact ( qty off balls) then a same size of QFP. I mean, theoretically unless the BGA is very heavy, it is more simple to solder mirrored PBGA then try to have QFP on bottom side to be soldered. Are ple
Electronics Forum | Tue Sep 14 12:29:15 EDT 2004 | samaniegocesar
Hello to all of you, may be you can help me, I change the X servocontroller of KME CM82C-MD and when the machine is mounting the component do not mount the component in the correct place, the initial components are correctly mounted but when the mach
Electronics Forum | Tue Sep 14 16:09:39 EDT 2004 | Guest
I want to show our production that changing over the pick&place line can be done much faster than we do now, but only if we organize things in a different way. What I would like to discuss with the operators is how Formula 1 teams are doing their cha
Electronics Forum | Wed Sep 15 05:33:04 EDT 2004 | Rob
Hi, The thing with Formula 1 is that they can afford to throw innumerable bodies at tasks (i.e. 8 people to change 4 tyres, 1 to hold a jack, 1 or 2 to refuel, 1 to hold a stop sign, 1 to hold a fire extinguisher, 1 with a stop watch, and the bloke
Electronics Forum | Wed Sep 15 11:05:16 EDT 2004 | rlackey
Hi John, It depends on what equipment and resources you have at your disposal - if you have an antique wave with crap adjustment & hand sprayed flux, no debridging/air knife system on a tightly packed board with a multitude of fine pitch connectors
Electronics Forum | Tue Sep 28 05:04:10 EDT 2004 | grayman
In obtaining almost zero defect in solder wave. I would like to suggest the following: First,We must consider changing machine if it is more than 5 years old. second, use the right tools for the right job. Most of the traditional engineers will us
Electronics Forum | Wed Sep 15 11:33:12 EDT 2004 | sue ph
We are building seven different assemblies that have flex circuitry that go off in four different directions within the panel. The panels are square to facilitate flow through smt & wave solder and depanilized in solder touchup. Currently, we are usi
Electronics Forum | Wed Sep 15 17:31:40 EDT 2004 | GS
Once you verified for correct profile ( consider CTE mismatch) make sure before you remove PBA from fixture, the temperature is almost at room temperature. If by removing PBA from fixture,and the PBA gets a little bent (warped) just in the area where
Electronics Forum | Fri Sep 17 23:19:07 EDT 2004 | KEN
What is the component ball co-planarity spec? I have encountered many ceramic and ASIC devices that specify 7 mil max. If your stencil is 4, 5, 6 mil you WILL eventually have an open joint. You must deposit solder greater than or equal to your cop
Electronics Forum | Thu Sep 16 07:07:34 EDT 2004 | C Lampron
Hello Chris, "It sticks up about 3/8" or so above the surface of the board." Is this over the ridgid portion of the PCB or in between? Is it possible to create a support fixture for printing that has relief that will allow the flex to bow downward i
