Electronics Forum | Thu Dec 16 09:59:47 EST 2004 | saragorcos
Hi there - unfortunately, there are no good cleanliness specs available mainly because clealiness requirements are case sensitive - you should talk to Terry Munson at 765-457-8095 - he can definitely give you advice on Ion Chromatography, SIR, ROSE t
Electronics Forum | Wed Dec 15 15:24:22 EST 2004 | russ
I think they need to go after the real lead contaminants. PCB/electronic waste accounts for .01% of lead waste based upon my last info I rec'd. So this lead free agenda is really going to help alot isn't it. I believe that most of the lead contami
Electronics Forum | Fri Dec 31 10:22:54 EST 2004 | gpaelmo
I agree that something has to be done with the lead waste but I believe that a recycling program is a better alternative to lead-free. Isn't silver more toxic? How about the venting of alternate alloy fumes, let alone the effects on operators. I say
Electronics Forum | Sun Jan 09 19:34:06 EST 2005 | Bob R.
You're right that us in the automotive market are exempt, but that just delays the inevitable by two or three years. Our customers, especially Japanese, are pushing us to provide Pb free products in the '08/'09 timeframe so that the end customers ge
Electronics Forum | Mon Jan 10 18:16:32 EST 2005 | ricardof
Greetings from Mexico I can see several good opinions about the "real" need to chnage to Lead-Free processes, but at the end and trying to be real, is there any good path we could follow to stop this process? I can see a lot of work, investment in eq
Electronics Forum | Wed Dec 15 19:31:26 EST 2004 | Thomas Denison
We have a ceramic BGA that the component supplier has misaligned the spheres in the fixture so they slant .007" out of alignment from the substrate pads. When the devices are tested at the component manufacturer this alignment issue also causes the
Electronics Forum | Thu Dec 16 16:28:51 EST 2004 | Indy
Hi, We are using Sn/3.0Ag/0.5Cu solder paste on Pd/Ag pad metallization in one of our application. Could someone provide me information on the following: 1. How bad is the Leaching of Ag in SAC alloy and how it can be mitigated. 2. During reflow so
Electronics Forum | Thu Dec 16 18:36:01 EST 2004 | mattkehoe
We use water soluble solder paste. When it gets a little dried out, can we add something to rejuvenate it? Liquid flux? We do not place components, just print and reflow the solderpaste so solderballs, spattering, and other issues like those are of
Electronics Forum | Fri Dec 17 14:13:18 EST 2004 | Claude_Couture
I have done this several times in order to save my butt: adding liquid flux in a jar of not so fresh paste, stirring it slow for 2-3 minutes, to make it usable. Of course, use no-clean flux for no clean paste, etc. During one production slow-down,
Electronics Forum | Fri Dec 17 14:30:42 EST 2004 | Dreamsniper
I goy this issue: Voids in almost every ball of my BGA's prcessed since we changed our BGA via tenting to double tenting. The tenting is done with a dry film application to fill the via from the solder side then apply LPI Mask on the surface of the
