Electronics Forum | Thu Mar 08 07:24:40 EST 2018 | proceng1
That's what I said when we started talking about 48inch boards. Everything changes. New printer, bigger stencils, new pick & place. Different even profiling (the board is in 3 zones at the same time). Plus board racks don't work well. The old Boa
Electronics Forum | Mon Nov 06 21:02:45 EST 2017 | dlerkin
Hi, I'm looking for a software copy for the CyberOptics Cyberscan Cobra Laser Profile Scanner. An issue with one of the files is preventing the software from running and we no longer have the original copy to re-install it on our computer. This Cyber
Electronics Forum | Tue Nov 07 08:10:54 EST 2017 | smtpatrick
I have a number of nozzles for an Assembléon AX-201 that have been allowed to become clogged with old, dried-out solder paste. I am thinking of using an ultrasonic tank in an attempt to clean them for re-use, but I am concerned that isopropyl alcoho
Electronics Forum | Mon Nov 13 09:40:01 EST 2017 | philc
Just a few thoughts, as we use similar quite frequently without issues. Ensure correct support when pasting the board, especially if it is thin. Correct support when placing the part. Is it placed correctly by the machine? If it is very slightly of
Electronics Forum | Fri Dec 01 12:56:33 EST 2017 | emeto
It seems that it will work with 5 mil stencil. To be safe use 4 mil if the rest of the design allows it. 10x20mil apertures for both rows. If you have bigger footprint in the corners, make bigger apertures there. For the ground plane, I would use ver
Electronics Forum | Sat Dec 02 10:23:47 EST 2017 | tomh
Have you ever heard of "Solder Mask Defined Thermal Pads"? I wrote a short blurb on this here - https://www.pcblibraries.com/forum/ipc7093a-btc-qfn-solder-mask-defined-thermal-pad_topic2154.html This technology saves fabrication costs by not havi
Electronics Forum | Mon Dec 04 08:43:39 EST 2017 | bandjwet
If you are looking to rework (after all of the previous suggestions are taken and tried....you have some solid ones in there). When a device like this is placed and is hard to get to we use the 7721 bumping process using a controlled heat source (no
Electronics Forum | Mon Nov 13 14:58:56 EST 2017 | davef
Determine the origin of the solder * Sloppy paste printing technique * Lax stencil underside cleaning practices * Sloppy misprint cleaning practices * Poor part placement practices creating solder balls * Poor material control allowing solder p
Electronics Forum | Mon Nov 13 12:17:58 EST 2017 | slthomas
Hi All, We have a new customer with a new design asking for us to leave the center VIP (8 mil drill) on a 9 ball uBGA (.5mm pitch) unplugged. What are my options should I be unable to convince them that this is going to be problematic? Obviously it
Electronics Forum | Mon Nov 20 12:36:42 EST 2017 | emeto
Hi, there are several things that I see here. 1. Part is saying misaligned on the top blue bar and missing on the initial list. 2. Part is neither misaligned, neither missing - it is wrong value. 3. How is your part thought? How many inspection wind
