Electronics Forum | Tue Feb 12 11:26:31 EST 2019 | aldrich17
Does anyone have any info. on an "E869" error code on a Phillips Topaz X SMT machine. Error screen shows "Nozzle down limit sensor is off in A-table YV100X:N2323 YV100XT:n2223 Please check sensor and remove to the cause of this sensor being off.
Electronics Forum | Tue Feb 12 12:32:45 EST 2019 | aldrich17
Your response is helpful to a point. But unfortunately i can not confirm where the sensor is as i do not know what the A-table is. But i have checked sensors that i know of and one was not giving off a signal and fixed that issue. But now i am experi
Electronics Forum | Wed Feb 13 14:15:06 EST 2019 | slthomas
I don't see any attachments.....? Are the fiducials consistently well finished (perfectly round, shiny without splotches or other imperfections), or do they vary in quality? When you do a fid offset, is the correction consistent or do you get varie
Electronics Forum | Wed Feb 13 15:12:09 EST 2019 | slthomas
The reason I asked about using X-Y data (originated from the pcb files) is that if you bombsite the locations with the camera and program or adjust them individually, you run the risk of having to do it over and over when fiducials change, your fixtu
Electronics Forum | Fri Feb 15 15:37:35 EST 2019 | emeto
Hello, I have a capacitor that doesn't form intermetallic joint with SAC 305 solder paste.The board is ENIG. Solder melts and forms good intermetallic joint with the PCB finish. However, capacitor can be removed with physical force - it looks like a
Electronics Forum | Tue Feb 19 13:00:25 EST 2019 | slthomas
Everything rob said makes perfect sense. That said, do you have a robust, infallible paste management system? ;) Have you tried multiple tubes and multiple date codes of paste and had the same results? Is it stored properly (on the tip, assuming i
Electronics Forum | Sat Feb 16 07:21:17 EST 2019 | SMTA-Joe
I am experiencing a "tarnishing" issue on PWB traces that may be causing problems with component reflow. The PWB traces are made to the following spec: SOLDER MASK OVER BARE COPPPER WITH SILVER IMMERSION PLATING PER IPC4553, PLATING TO BE 8-12 MIC
Electronics Forum | Sun Feb 17 17:55:21 EST 2019 | davef
Each time that you cook imm surfaces, you give-up coating thickness. Spec IAg can take maybe 4 thermal cycles ... [that's what I remember but those could be PbSn, not SAC cycles]. Anyhow, the more that you decrease coating thickness, the more that Cu
Electronics Forum | Mon Feb 18 09:25:20 EST 2019 | davef
It doesn't matter if the traces have solder or not. We're talking thermal cycles. RE IAg thickness: I believe the IAg is a self limiting process, similar to IAu. Your fab may be able to help a little, but I don't expect a substantial change. And if
Electronics Forum | Tue Feb 19 10:50:13 EST 2019 | rgduval
Call Heller directly, and give them the oven, and relative thermal density of the board, as well as the solder paste that you're using. They'll be able to give you a baseline profile to start from (both RTS and RSS). Otherwise, use a thermocouple p
