Electronics Forum | Sat Mar 20 15:59:13 EDT 2010 | emanuel
I have a big problem in setting an smd inductor camera recognition. None of the existing options in the software version 0.99B sems to work. The part is a 6x6mm with chamfer corners of 1mm on each side, looking more as an octagon. Not only this, the
Electronics Forum | Tue Mar 23 14:08:57 EDT 2010 | davef
You have what looks to be blisters/delamination. Use IPC-A-600F as a guideline for acceptance. Usually, we start from the opinion that blisters/delamination as a fabrication issue, even if it appears during solder processing. Often blisters/delam
Electronics Forum | Fri Mar 26 11:31:34 EDT 2010 | rway
I have been using ICT for a number of years. It is still a viable resource for catching defects in the production process. AOI doesn't catch everything, such as bridging on QFN or J-lead devices (this will depend on the type of AOI and camera syste
Electronics Forum | Fri Nov 18 12:35:15 EST 2011 | rway
As the article eludes to, you still need probe access to measure the pins with TestJet. One thing I wanted to add was the use of JTAG for use with Boundary Scan. Certain devices have JTAG capability, but not all JTAG devices are Boundary Scan compa
Electronics Forum | Tue Mar 23 18:02:54 EDT 2010 | rodrigo
Hi all, We're setting up a cp-65 and we're finding some issues with it. It has a missing 1st solenoid/switch and some nozzle valves on the cam. The biggest issue is this C axis servo error. The proper data was set to a cam speed of 250 (25%). That's
Electronics Forum | Thu Mar 25 07:59:57 EDT 2010 | fredc
Hello Rodrigo, My expierence is with metal cutting machine tools not Fuji placement machines. That said there are a several of areas to look at. #1.Interference on your C axis travel, look for scrape marks or something dragging on the drum. #2. Tigh
Electronics Forum | Fri Mar 26 10:35:52 EDT 2010 | grahamcooper22
Hi Krish, thanks for your detailed reply. Sorry I assumed you may be using a solder paste to solder the BGA to the pcb. Either solder paste or Gel flux is best for resoldering BGA to pcb. Are you using Gel flux ? Most popular long term storage for mo
Electronics Forum | Sat Mar 27 03:57:09 EDT 2010 | grahamcooper22
I agree with Steve. Your are too hot and too hot for too long. What is the device spec for Peak Package Temperature (PPT)? (this is usually on the moisture barrier bag) Many leaded BGAs have PPT of 225 Deg C. Even if it is higher, like Steve suggeste
Electronics Forum | Wed Mar 31 09:44:12 EDT 2010 | bandjwet
One thing I would suggest right off the top is to go to a paste printing process. This will get first pass yields higher (usually 10+% higher than gel flux). If you are suggesting that you have good collapse everywhere, the profile is adequate (soun
Electronics Forum | Fri Mar 26 21:36:03 EDT 2010 | cusackmusic
I posted this once, but it disappeared. Anyway, we have an Ersa Hotflow 5 that is our backup, but I doesn't power up anymore. I've called Ersa several times, and they don't return my calls. It powers up, and communicates with the PC, but the scree
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