Electronics Forum: viewing (Page 7026 of 7890)

Yestech AOI question

Electronics Forum | Thu Dec 16 14:50:49 EST 2010 | rway

What Derek means is, you will have to train new templates from time to time, something you have to do with every AOI. Because there is no established method for marking parts, these markings can change. For instance, the text on chip resistors coul

ROGER 4003C bounding to Aluminum

Electronics Forum | Thu Oct 21 02:31:27 EDT 2010 | rok

OGER 4003C bounding to Aluminum I am hoping someone might have the solution to my problem I have the following PCB: RO4003 Thickness: .2mm Layer: top single/ bottom ground plane Finish: silver top and bottom .2um Size: 3mmx6mm I need to bound/groun

SMT parts loss

Electronics Forum | Thu Oct 21 12:44:07 EDT 2010 | swag

We issue extra parts like this: 8/2 caps and resis. - 40 over 8/4 caps and resis. - 20 over 8/4 IC's - 7 over 12mm - 7 over larger feeders + stick + matrix = the correct # req'd. These #'s were based on our first SMT lines (used equip.) and we made

Part coating flowing into solder joints

Electronics Forum | Fri Oct 22 18:57:25 EDT 2010 | jry74

I am having a horrible time with the square radial lead capacitors (thru hole components) and the part coating flowing into the solder joint. These are Class 3 products. When we run them through the wave solder machine, the solder travels up the le

0402 Cap tombstoning strange behaviour

Electronics Forum | Thu Nov 04 04:27:46 EDT 2010 | d0min0

thanks for all the feedback... we also checked, just in case : - bake the components (no visible improvement) - bake the pcb (50% less tombstone components) - finally we changed LF paste to completely different manufacturer - and booom 0 (zero) tombs

Crystalization on TI QFP and other fine pitch components

Electronics Forum | Thu Oct 28 11:50:11 EDT 2010 | phase1

We are having a little trouble with what appears to be a crystalization between our fine pitch parts. The problem appears after a a thourough wash of the pcb when dry. It looks like lead wiskers/haze between the joints.We are using water soluable lea

Mirtec programming discussion

Electronics Forum | Sun Nov 14 14:14:47 EST 2010 | methos1979

On the bare boards, no paste, just a bare FAB board. We get them from a PWB manufacturer and inspect them to IPC-A-600 and then ship them to another manufacturer to populate them and we then inspect them to IPC-A-610. I have written several program

Mirtec programming discussion

Electronics Forum | Thu Jan 13 20:40:47 EST 2011 | eadthem

properties > settings > troubleshooting > Set hardware acceleration to NONE > apply OK apply OK reboot. without this any attempt to take a screen shot of the program will not save the image (because in a fruitless attempt to speed it up they have pr

Mirtec programming discussion

Electronics Forum | Wed Jan 19 12:54:17 EST 2011 | bdamico

Hello Mark, The centroid data you are currently using to program the MV-2HTL may be used with either platform. However, the libraries cannot be shared due differences in camera resolution. The MV-2HTL will have a 1.3 megapixel camera versus the 2 m

How to place cylindrical (MELF) parts on Quad P&P

Electronics Forum | Fri Nov 05 11:30:53 EDT 2010 | deanm

We have a Quad QSV-1 pick and place machine that has performed fine for us with the exception of cylindrical glass (MELF) type diodes. The machine often fails to pick these out of the tape to the point where it is easier to hand place them. As far


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