Electronics Forum: viewing (Page 7226 of 7890)

Re: Reflow Oven

Electronics Forum | Thu Jun 15 21:51:17 EDT 2000 | Dave F

Jeff: You're correct �7.1.3 of ANSI J-STD-001C states " Drying / Degreasing states the assembly may be treated to remove moisture and other volitiles." We don't bake "FR4" for love nor money. The archive are littered with threads along this line.

Re: Soldermask Design Rules

Electronics Forum | Tue Jun 13 21:57:01 EDT 2000 | Dave F

Todd: You say: "... solder masking between the lands of fine pitch components can cause stenciling problems and or manufacturing problems." I say: Fine pitch components without solder masking between the lands can cause stenciling problems and o

Re: Soldermask Design Rules

Electronics Forum | Fri Jun 16 06:24:43 EDT 2000 | Wolfgang Busko

Hi Todd, it might be a philosophical question if soldermask between finepitch pads is prefered or not. That should depend on the capabilities of a particular site and their experience. We actually prefer soldermask down to 0,4mm pitch and don�t have

Re: OnBoard Forum

Electronics Forum | Tue Jun 13 21:07:54 EDT 2000 | Keith Luke

Cunli, Thanks for the feedback on OnBoard. We will be introducing the new OnBoard Forum component page next week. There you will be able to quickly access archived OnBoard Forums, and see our schedule of upcoming events. We are still weighing w

Re: wave solder

Electronics Forum | Mon Jun 12 22:02:48 EDT 2000 | Dave F

Jason: Wave soldering is the coolest thing!!!! First, so, what�s the chemical analysis of this white res? Can you point us to either tin, rosin, or something else? Second, how do you know that you are making these white residues? Could your boar

Re: solder joint problem?

Electronics Forum | Wed Jun 14 08:08:56 EDT 2000 | Wolfgang Busko

Hi ji tae, we had a similar problem with QFPs 0,5 pitch processed by one subcontractor. The symptoms we noticed were: - the solderjointshape and wetting looked normal - the surface had a dull gray appearance - by pushing a lead sideways with a tweez

IP3 QFP Problems - Has anybody had the same probs?

Electronics Forum | Fri Jun 02 17:19:56 EDT 2000 | Big K

I am currently experiencing several problems with QFP's on one of our IP3's. The first problem is with QFP240 devices. We are experiencing a high reject rate with these parts when using vision type 100. What appears to happen is that the vision syste

Re: IP3 QFP Problems - Has anybody had the same probs?

Electronics Forum | Mon Jun 05 22:40:40 EDT 2000 | Dean

...well, if I had Fuji in on 4 occasions and the problem is not resolved I would wonder what exactly I paid for... Here is what I would do. 1. Run the glass plate program. This will eliminate variables in your production parts and boards. Additi

New Search Capability!

Electronics Forum | Fri Jun 02 10:07:15 EDT 2000 | aflewelling

A new and more powerful search function will be in place on SMTnet by noon Friday June 2nd. The new search feature allows you to search all of the SMTnet components individually and have the results displayed to you more quickly than under the prev

Re: CONNECTOR ISSUE

Electronics Forum | Tue May 30 11:51:43 EDT 2000 | JAX

Sal, I have seen this problem placing SMT connectors which exceed 60mm in length. Although I did not use siemens equipment at the time I am not sure if they will place enought force to seat the entire connector flush to the board. They have a maximun


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