Electronics Forum | Wed Apr 27 11:43:32 EDT 2005 | patrickbruneel
Hi Daan, What we did in the time was pareto analyses on all board designs to determine the critical areas (mainly design errors) and only inspect those specific problem areas. Every batch had a copy of the PC board with problem areas marked and only
Electronics Forum | Mon Apr 25 11:24:31 EDT 2005 | Daan Terstegge
I have a question about inspection, touch-up, and how far you need to go to get a product that meets the required IPC-spec. According to some reports (i.e. "New Study Reveals Component Defect Levels" by Stig Oresjo of Agilent) the average defect leve
Electronics Forum | Sun May 02 16:57:09 EDT 2004 | davef
You're correct. We prefer to probe solder, rather than copper, because the solder absorbs the impact of the probe better than copper and so, helps preserve the life of the probe. Beyond that, OSP has a limited "shelf life". If the OSP is not coate
Electronics Forum | Sun May 02 10:25:31 EDT 2004 | Bryan She
I'd thought that the solder on test pad can benefit our ICT,but in fact,the residue issue arised.I'd like to know how do you test your OSP board? Thanks Bryan
Electronics Forum | Fri Apr 30 12:34:12 EDT 2004 | Bryan She
Hello all, these days I've met an OSP board testability issue. 1.OSP board 2.Solder paste:Kester R244 no clean paste 3.Print solder paste on test pad. Issue: There's brone(light yellow)flux residue on test pad,and the probe can't penetrate the residu
Electronics Forum | Sat May 01 07:32:29 EDT 2004 | davef
Just to be use that we're heading in the correct direction, you're probing solder, not copper, correct?
Electronics Forum | Fri Apr 30 16:51:57 EDT 2004 | davef
This issue is not "testability of OSP board". It is "testability of nc flux residue". Kester [or some other flux suppler] can probably recommend a flux residue that is more probeable. We have talked about the problems with probes getting gummed-up
Electronics Forum | Sat Sep 08 08:55:24 EDT 2007 | davef
We expect to see a copper shadow along the edge of pads when soldering boards with organic solderability protection [OSP]. IPC-A-610 has defined this as acceptable for years. During early reflow stages, the flux in paste dissolves the OSP where ther
Electronics Forum | Wed Oct 09 13:05:34 EDT 2019 | dwl
In my experience 100% visual inspection of a first article is good but visual inspection of production boards is not really useful, if you have AOI and ICT. If your process is good and defects are uncommon, human inspectors go on autopilot and miss m
