Electronics Forum | Mon Aug 11 21:49:37 EDT 2014 | cmchoue
You mean that is void size or area can't cover via hole?
Electronics Forum | Thu Mar 16 17:33:40 EDT 2017 | dontfeedphils
Voiding, fracturing, barrel-fill, I'm sure there are some I'm missing.
Electronics Forum | Thu Jan 18 17:26:30 EST 2018 | davef
I'm aware of no electrical test for detecting voids and air bubbles. If someone was x-raying my boards and saw voids and air bubbles and they weren't happy about it, first thing I'd do is convince them that the boards a within standard. You know some
Electronics Forum | Thu May 03 14:35:13 EDT 2018 | jimpat
Also, are there any other industry practices for void reduction? I read that Nitrogen helps.
Electronics Forum | Thu Jul 12 09:11:48 EDT 2018 | buckcho
Hello, can you show us some sample pictures and where exactly you get this?
Electronics Forum | Fri Jul 20 13:50:22 EDT 2018 | vchauhan
This question is regarding stencil design: I am having voids under QFN TI P/N LMZ20502SILT. I have attached component pic. Signal pin is 18X16 mils. Center pads are 31 mil sq. Initially I had stencil done with one mil per side reduction on signal pad
Electronics Forum | Thu Jul 26 09:47:30 EDT 2018 | vchauhan
Rob, Thank you so much for your suggestions. Vinod.
Electronics Forum | Fri Jul 27 09:58:33 EDT 2018 | vchauhan
Dave & Rob, You guys are great. Appreciate your help.
Electronics Forum | Tue Aug 14 09:32:46 EDT 2018 | vchauhan
Thank you so much.
Electronics Forum | Wed Jul 03 09:47:39 EDT 2019 | SMTA-Pat
We have seen that vias included in the PCB under the thermal pad will give less voiding.
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