Electronics Forum | Wed Aug 26 12:06:44 EDT 2009 | clampron
Good Morning, I have been struggling with this part for some time now. I have to agree that whoever designed this part, did not have to manufacture with it. We have advanced to a point where they have a acceptable yield but I believe that will be hi
Electronics Forum | Fri Oct 30 08:24:12 EDT 2009 | rajeshwara
thnx davef & all With the help of all at last i solved the problem , The vias are not caped from bottom , so solder paste draining through the via to the floor which creates voids between IC ground pad and e-pad. Tnhx all again
Electronics Forum | Thu Nov 19 22:52:34 EST 2009 | davef
Something is incorrect. Either: * Assembly dead functional and when we press BGA by thumb it works ... OR * Cross section with no voids , no solder joint crack. Turn-off the smoke machine.
Electronics Forum | Mon Dec 21 14:38:11 EST 2009 | bandjwet
Does anyone know of a vendor of "black top" to fill in voids left by laser "X-out" patterns in the top of an epoxy (plastic) package ? We are demarking an area of a device and would like to fill it in with something other than a colored epoxy. Reg
Electronics Forum | Fri Jan 08 16:48:21 EST 2010 | allwave
I did the same thing in ours (removed the chip wave). What kind of machine do you have? What I did on our TD machines, I added some extra channels to minize the solder "splash" on the void which is the reason more dross is formed. Hope this helps a
Electronics Forum | Wed Feb 03 22:29:08 EST 2010 | mika
via apertures > solderding of terminals to the pads! That is zero which means => 90 % solderjoint Terminal to pad! http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=13914&#Message58952
Electronics Forum | Thu Feb 18 22:06:55 EST 2010 | davef
Change your paste Search the fine SMTnet Archives for threads like: http://tiny.cc/LJ1rc
Electronics Forum | Fri May 14 09:00:35 EDT 2010 | rafacadiz
I attached a RX picture. A lot of voids and micro balls arround the flux residue. What do you think, relow temperature reflow or OSP poor weeting.? I appreciate your comments. Thanks,
Electronics Forum | Fri May 21 07:44:28 EDT 2010 | mun4o
hi, I have similar problem 2 year ago.BGA256 , hole in pad technology.I order PCB manifacturer to fill hole with solder mask.And now everything is ok. regards
Electronics Forum | Fri Jun 04 08:33:44 EDT 2010 | karthikthebest
Hi, Just have a look at the tech sheet on VIP, looks likes a continuing story until IPC defines the criteria in a better way
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