Electronics Forum: void and im (Page 1 of 59)

BGA void removal

Electronics Forum | Sat Oct 19 08:33:50 EDT 2002 | johnw

The whole thread seem's to have gone off track. Russ we've been doing a fairly big bit of work on the whole BGA voidign thing as we were so unhappy with the answer's that we were getting from around the industry, basically no one really kows all the

BGA void removal

Electronics Forum | Wed Oct 09 17:44:46 EDT 2002 | alj

I guess you don't use one. Call them and I'm sure they will solve your problems and teach you a little bit about BGA rework profiling... CHEERS!

Standard for BGA void

Electronics Forum | Mon Oct 21 03:52:38 EDT 2002 | Ben

I'm doing lead-free SMT of BGA with 450 micron ball. I found there are lots of voids under xray, there are around 2-3 voids in every balls. It is around 10% of volume ratio. I would like to ask if anyone know there is any standard of acceptable maxim

BGA void removal

Electronics Forum | Sun Oct 20 12:49:11 EDT 2002 | johnw

Dave, I've had a few intersting conversations with Dr Lee, now there's a guy who know's stuff, but as it turn's out even he doesn't have all the answers on why things void. Many of his papers point towards oxides or contamination on the ball, so age

solder void in oscillator joint

Electronics Forum | Tue Sep 04 10:27:33 EDT 2007 | rgduval

I haven't experienced this problem, exactly, but I have had issues with noise in digital circuits that appear to have gone away with touch up. The problem was that the customer blamed the noise issue on the solder quality, and he pointed to the fact

what kind of void test do u perform in paste industry

Electronics Forum | Fri Jun 16 11:37:15 EDT 2006 | docker

I�m working in Solder paste manufacturing industry and my customer has complained the void issue on BGA pad. I�m internally conducting the void test on BGA pad in my Lab. I used OSP furnish board with Sn/Pb and /or lead free component using Lead free

BGA rework and inspection

Electronics Forum | Thu May 30 10:31:03 EDT 2002 | robbied

Hi Yannick. This is an issue that we are just recently getting into but here is some ifo that I have gathered so far. I have seen/ used 2 different rework machines. The one we have bought is a 'PACE TF2000' which was at the lower cost end of the mar

Re: Reflow glue and past.

Electronics Forum | Wed Feb 09 21:29:28 EST 2000 | Dave F

Charlie: People cure glue using their paste reflow profile all the time. And most of them are happy. Personally, I�m with Dean and Travis. It�s possible to as you suggest, it�s appealing not to mess with your oven profile, but it just doesn�t s

Weak joint strength and black residue

Electronics Forum | Fri Jun 08 17:22:51 EDT 2007 | naynayno

We have been producing an IMS assembly with SMT dpak's for some time. However, we recently encountered a new problem by chance - the parts can be flicked off with a finger nail. I state by chance because the solder joints are wetted and shiny with

Indium No-clean and Inert Reflow oven (N2)

Electronics Forum | Thu Aug 01 12:55:41 EDT 2002 | johnw

we run the paste in both air and n2 depending on customer requirements again it run's fairly well in both. Some people say it's better sme say it doesn't make a bit of difference, I'm somewhere in between at the moment. I definately think there's imp

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