Electronics Forum: void weld (Page 1 of 1)

Re: lid soldering problems (CQFP, Au/Sn solder)

Electronics Forum | Fri Sep 18 08:49:12 EDT 1998 | Earl Moon

| | We have problems with voids when we solder lids to | | ceramic flatpackages. | | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | | The solder is attached to the lid (preform) and the solder

Flason SMT Products

Electronics Forum | Wed Oct 03 23:58:23 EDT 2018 | gaintstar

Flason SMT News: http://www.flason-smt.com/new/6-Things-to-Check-Before-Submitting-Your-PCB-Design-for-Manufacturing.html http://www.flason-smt.com/new/about-wave-soldering-machine-tin-pot.html http://www.flason-smt.com/new/Advantages-of-Design-for-

aluminium wire bonding on Electroless Nickel + Immersion gold

Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef

This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R

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