Electronics Forum | Sat Jun 01 04:27:37 EDT 2019 | gregoryyork
Increase paste volume and use ramp soak spike profiling. Reducing volume of paste often leads to entrapment. Good idea to know difference between voiding and dewetting due to contamination
Electronics Forum | Tue May 21 15:16:16 EDT 2019 | emeto
Voiding usually is caused by oxidation/impurities on the plating of part and or PCB. I know it is gold, but did you run any analysis for cleanliness of part plating? Couple of pictures will help everyone.
Electronics Forum | Thu Nov 21 21:22:15 EST 2019 | sssamw
=50% area soldered. If you need less void the the grounding area, you can increase solder paste area/volume.
Electronics Forum | Tue Nov 26 09:05:48 EST 2019 | scotceltic
Thank you for the response. Nothing in the datasheet referring to a percentage of thermal pad coverage. I am thinking along the same lines. We are not failing any thermal or functional testing as is so am thinking there is no problem here except m
Electronics Forum | Tue Nov 26 18:35:20 EST 2019 | slthomas
It's hard to tell from the image but it looks like there isn't much room for a heel fillet. Seems like that could contribute to your voiding (or poor wetting) if there isn't enough paste volume there.
Electronics Forum | Wed Dec 11 07:58:38 EST 2019 | clockwatcher
Although this is not technically a bottom termination component, the method of attachment of the thermal pad is a bottom termination attachment. For bottom termination components IPC states that "thermal pad void criteria shall be established between
Electronics Forum | Sat Jan 04 08:58:30 EST 2020 | SMTA-Davandran
I do faced this problem and and not solve. Fortunately, did not seeing any functional failure from this voiding which approx 50%.
Electronics Forum | Tue Jun 16 14:26:41 EDT 2020 | rsatmech
Hello all, I am randomly getting solder short due to voids in the BGA Reference image attached. Kindly provide your thoughts on this as how to approach to resolve this issue.
Electronics Forum | Tue Jun 30 09:59:44 EDT 2020 | cph4w
Hi SRINI, Are you able to show X-ray of these 2 locations from other board w/o bridging? Void looks almost perfect circle which I never encountered before.
Electronics Forum | Tue Jan 19 10:27:33 EST 2021 | grahamcooper22
Anyone experience high voiding levels in SMT lead free solder joints when the CHIP has bright tin plated end caps ? In the same process, Matte tin plated CHIPs don't show any voiding issues.
