Electronics Forum | Wed Jun 27 21:56:31 EDT 2012 | davef
I'm spinning on this. Are we talking PTH or SMT?
Electronics Forum | Thu Oct 11 14:32:30 EDT 2012 | blnorman
Are the microvias in the BGA ball pads?
Electronics Forum | Mon Oct 15 10:47:54 EDT 2012 | aj
have you xrayed any of the BGA's before you reflow them?
Electronics Forum | Fri Feb 01 19:07:57 EST 2013 | hegemon
We have had some success in void reduction with LGA by pre-tinning or "bumping" the devices before placement. The extra solder seems to allow a slightly higher standoff, and allows better outgassing, is my guess. A lot more labor , but the results
Electronics Forum | Tue Sep 24 10:09:52 EDT 2013 | leigh
Windowpane your ground planes, this will prevent a lot of voiding.
Electronics Forum | Thu Jul 31 21:57:26 EDT 2014 | cmchoue
What kind of stencil pattern is the best for QFN(Avoid void) Can somebody help me? Thanks!
Electronics Forum | Mon Aug 11 21:49:37 EDT 2014 | cmchoue
You mean that is void size or area can't cover via hole?
Electronics Forum | Thu Mar 16 17:33:40 EDT 2017 | dontfeedphils
Voiding, fracturing, barrel-fill, I'm sure there are some I'm missing.
Electronics Forum | Thu Jan 18 17:26:30 EST 2018 | davef
I'm aware of no electrical test for detecting voids and air bubbles. If someone was x-raying my boards and saw voids and air bubbles and they weren't happy about it, first thing I'd do is convince them that the boards a within standard. You know some
Electronics Forum | Thu May 03 14:35:13 EDT 2018 | jimpat
Also, are there any other industry practices for void reduction? I read that Nitrogen helps.
