Electronics Forum | Mon Jun 07 22:05:58 EDT 2004 | Ken
Me too. Check out this months Circuits Assembly. Dage has an interesting article about voiding as a function of surface plating....
Electronics Forum | Fri Jun 25 13:35:13 EDT 2004 | tcp
We have beaten the reflow profile angle to death and haven't been able to duplicate the condition, so I don't think that is the problem. The voids were visible on the surface of the remaining solder. Where the lead tore out of the solder left indic
Electronics Forum | Wed Oct 20 13:53:22 EDT 2004 | Greg D
Hi, What's the maximum and minimum solder void that can be accepted during X-ray? What about the percentage of Ball Roundness..20%? 30%? thanks and regards,
Electronics Forum | Fri Dec 03 12:27:41 EST 2004 | mruzicka
I did a quick search and ran across this: www.nepcon.co.uk/files/pt_kbryant.pdf You can also look here http://listserv.ipc.org/scripts/wa.exe?A1=ind0411&L=technet post #32.
Electronics Forum | Mon Dec 13 14:41:41 EST 2004 | DasonC
Check IPC-7095, 7.4.1.6 For Class 2, 45% of the diameter adn 20.25% for the area.
Electronics Forum | Wed Jan 12 17:47:13 EST 2005 | Dreamsniper
I wanna make a MSExcel spreadsheet that will automatically convert Percent Area of a BGA void to Percent Diameter. What is the formula? Thanks and regards,
Electronics Forum | Wed Feb 02 16:24:14 EST 2005 | bobsavenger
I would like to know if anyone has an IPC specification for BGA's handy? I'm looking for specifics based on Classification. Roundness, %voids, size, etc. Please let me know if you have this. Thanks Bob
Electronics Forum | Tue Jul 26 05:57:27 EDT 2005 | GS
Why you do not try by yourself ? Run some BGA reflow with and without N2 then X-ray the solder joints. Regards GS
Electronics Forum | Mon Sep 19 09:08:25 EDT 2005 | siverts
Search the SMTnet archives first. Ex. http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=8877&#Message35126
Electronics Forum | Wed Nov 09 09:41:44 EST 2005 | chunks
Wetting with lead free at wave is a bit different. You may need to increase your flux parameter to gain top side wetting. May get rid of the voids too.
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