Electronics Forum | Mon Sep 17 14:45:57 EDT 2012 | kkay
We are experiencing voiding on one of our lead-free assemblies on every part. The voiding only occurs underneath the parts and not in the solder fillet (see pic). We have tried baking, curing, washing, multiple pastes and everything else we can think
Electronics Forum | Fri Mar 19 10:27:42 EDT 2010 | karlo
No clean pastes leave more flux residues. These can result in void formation and inhibtion of underfill curing. Selection of an underfill that is compatible with the flux residue is important. One company that has written about the effect of flux
Electronics Forum | Wed Feb 09 21:29:28 EST 2000 | Dave F
Charlie: People cure glue using their paste reflow profile all the time. And most of them are happy. Personally, I�m with Dean and Travis. It�s possible to as you suggest, it�s appealing not to mess with your oven profile, but it just doesn�t s
Electronics Forum | Thu Jun 22 17:47:05 EDT 2006 | davef
First, we expect voiding in imm silver to be similar to ENIG. We expect more voiding in OSP than other common solderability protection. Second, choosing a solder paste, which does not contain resins and activators that decompose at higher temperatu
Electronics Forum | Wed Oct 17 09:55:48 EDT 2012 | anvil1021
Has anyone ever experienced void increase while using N2? Thanks for the Help!! anvil
Electronics Forum | Sun Mar 01 14:51:55 EST 1998 | Vincenzo Longobardo
From several months I am investigation about the VOIDS PERSENCE and his important as reliability. One question now is : It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? If you ha
Electronics Forum | Thu Jun 22 00:16:24 EDT 2006 | Gman
Hello, Has anyone had issues with voiding while using Imm Silver PCB finish. Does thickness of silver, contamination of the plating bath or other factors if you come point out cause voids due to the plating.
Electronics Forum | Fri Jun 23 10:10:15 EDT 2006 | Gman
Some amount of voiding was always seen on sites where solder paste is printed. These voids are much smaller. However the site where a flip chip is flux dipped has never had problems with voiding. Macro voids (and huge ones at that)across the board s
Electronics Forum | Thu Oct 18 11:08:22 EDT 2012 | scottp
Since we follow IPC Class III, I've done experiments turning N2 on and off and measuring void level with both SnPb and SAC305 solder. In both cases there was a statistically significant, measurable increase in voids with N2, but it wasn't significan
Electronics Forum | Thu Mar 13 09:43:13 EDT 2008 | jseagle
If the mask is not cured and is coming off in the pot I don't see how it is protecting anything. If you want to mask something fast you need to use tape not liquid mask that requires cure. My $.02.
