Electronics Forum | Thu Aug 13 07:53:40 EDT 1998 | Earl Moon
| | Couple of questions. | | 1) Are we talking alumina substrates as the ceramic material? | | 2) Are we co-firing gold as the conductors on the substrate surface? | | 3) In other words, is this a hybrid thick film circuit? | | 4) If so, how large or
Electronics Forum | Thu Aug 13 03:10:22 EDT 1998 | Terry Keen
| Couple of questions. | 1) Are we talking alumina substrates as the ceramic material? | 2) Are we co-firing gold as the conductors on the substrate surface? | 3) In other words, is this a hybrid thick film circuit? | 4) If so, how large or small? S
Electronics Forum | Wed Aug 12 07:31:37 EDT 1998 | Earl Moon
| We are taking enquiries for sub-contract work that we hope to be doing by Christmas. One of the enquiries is to assemble chip capacitors and an SO14 onto ceramic. Does the printing process, paste used and reflow process remain the same, or are ther
Electronics Forum | Wed Apr 06 12:21:14 EDT 2011 | ripper
Hi, I am process engineer in PCBA factory.I have a question about gold plating on BGA.I want to know difference soldering performance between gold plating electrolytic and ENIG.Many thank for any idea.
Electronics Forum | Wed Apr 06 13:43:14 EDT 2011 | mosborne1
ENIG is the way you need to go. With ENIG you deposit a lot less gold. Too much gold will cause soler problems. Matt www.americancircuits.com
Electronics Forum | Thu Apr 07 02:38:20 EDT 2011 | aungthura
I didn't know the difference for BGA. We found solderability probelm as show in attach.Then, we called to PCB maker and they said that it could be caused because of PCB finishing. Do you agree this probelm was happend because of PCB finishing? Unfor
Electronics Forum | Thu Apr 07 09:04:19 EDT 2011 | mosborne1
First of all you need a new board house. You should quote us http://www.americancircuits.com. This really looks like a poor drilling operation with the blow holes. Blow holes are usually caused by two main problems. Improper drilling and/or moisture.
Electronics Forum | Wed Oct 02 15:20:55 EDT 2002 | Eric
Is there a steadfast rule of thumb for a good solder joint on an Enig Gold board. I come across this number 217C when discussing BGA profiles. Is this a published number? I sure could use a reference. Anybody feedback is appreciated.
Electronics Forum | Thu Sep 26 20:43:51 EDT 2002 | davef
"OK. If the connection doesn't look like I expect it to look, how do I know that the metallurgy is correct?" Comments are: * There are no pictures that will get you though this. * You should expect that gold that is dissolved in Pb/Sn solder to make
Electronics Forum | Wed Oct 02 16:13:05 EDT 2002 | babe
Have you had your solder pot tested? I find that levels of contaminants can rend a solder joint that dull look.
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