Electronics Forum | Mon Jan 13 16:23:29 EST 2003 | Eric Brown
Does anyone know of documentation that specifies whether or not voids in BGA solder joints hurt or help performance?
Electronics Forum | Thu Apr 23 22:01:07 EDT 2009 | davef
That you have one BGA of 30 BGA that has voids, makes us wonder what's the deal with that one BGA. Especially given that this is the initial run of a product with BGA at your plant, it really makes us want to understand just what is driving the voidi
Electronics Forum | Mon Jan 13 18:22:55 EST 2003 | davef
100 sec) and decrease reflow temp to 205C. * Understand that voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on a temporary basis. There is no standard, IPC or otherw
Electronics Forum | Fri Apr 24 06:16:50 EDT 2009 | naguiar
CHANGE SOLDER PASTE, AND ADJUST PROFILES. Nolasco
Electronics Forum | Mon Jan 17 13:09:12 EST 2000 | Dennis _F
We seem to have voids show up in one out of 5 BGAs during x-ray inspection. The x-ray is set up to accept the joint with anything less then 30% void area. I need anyones input of what during the process we can do to decrease the voiding and/or a good
Electronics Forum | Thu Apr 23 15:46:08 EDT 2009 | ccross
During initial profiling we shoot for 15% or less voiding on our BGAs. During production runs we consider voids under 15% to be ok. Voiding between 15%-25% we string tag and pay more attention to during test. Over 25% we consider a reject.
Electronics Forum | Wed Jan 15 23:32:36 EST 2003 | tinson
How about section 12.2.12 of IPC-A-610C? It doesn't include detailed description of root cause/effect but acceptance criteria.
Electronics Forum | Thu Apr 23 00:27:06 EDT 2009 | josephkhiew
25% void (total pcba inspected is 15 boards, each board has 2 BGAs and each BGA has 64 balls). Referring IPC-7095 stated that there is no evidence or empirical data that indicates that voids within ball will cause failure. We would appreciate if y
Electronics Forum | Thu Apr 23 07:51:45 EDT 2009 | scottp
Every paper I've seen published shows that BGA voids either have no effect or actually give a slight improvement. The one exception are voids with a root cause in bad incoming boards, such as champagne voiding where nearly the entire interface is go
Electronics Forum | Mon Apr 27 19:31:12 EDT 2009 | stevek
Remember that the 25% is a reduction in cross sectional area. A void in the middle of the ball that reduces the cross sectional area by 25% is about half the diameter of the ball. If it is closer to either termination, the corresponding size would
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