Electronics Forum | Tue Oct 29 09:01:34 EST 2002 | russ
Does anybody know of any document(s) that define the different package types such as SOP, SOIC, VSOP, TSOP,TSSOP, QSOP, LQFP, VQFP, etc...? I am re-doing our component library and would like to use industry names for each component type. Thanks Rus
Electronics Forum | Tue Oct 29 15:07:38 EST 2002 | gregp
SOP small outline package, SOIC small outline integrated circuit, VSOP very small outline package, TSOP thin small outline package,TSSOP thin shrink small outline package, QSOP ???, LQFP low profile quad flat pack, VQFP ??? The packages come and go
Electronics Forum | Fri May 06 06:51:55 EDT 2016 | abhilash4788
Hi All, One of my customer has provided a pcb design having common pad for 0402 and 1206 package(i.e 3 pads in the gerber, pad1,pad2 belongs to 1206 package and pad2,pad3 belongs to 0402 package) Will this create any solderability issue. Is anyone e
Electronics Forum | Thu Feb 11 07:24:40 EST 2016 | truewanderer
I'm planning to design the pcb of my project. The controller used is having 136 pins and the package is P-LFBGA. So i think i need to design a 6 layer board for better performance. I haven't designed a multi layer board before. So what are things tak
Electronics Forum | Fri Feb 19 05:08:40 EST 2016 | truewanderer
Thank you Tsvetan Usunov
Electronics Forum | Fri May 06 08:39:59 EDT 2016 | kahrpr
The first issue I see is that you have a high potential of the 402 tombstoning.
Electronics Forum | Fri Feb 19 05:14:04 EST 2016 | truewanderer
Hi, i have a confusion to read the dimension of BGA package from the datasheet. I have attached the datasheet below. Is this diameter of the ball 0.30mm or 0.15mm. I'm confused about the values given in the box. Whats meant by M, S, A and B. Please g
Electronics Forum | Fri May 06 08:47:05 EDT 2016 | davef
You're correct. This design will have a record amount of 0402 rework for tombstoning and misalignments. Suggest that the pads on each end of all components be the same size in order to balance wetting forces during reflow.
Electronics Forum | Mon May 09 09:23:45 EDT 2016 | markhoch
I agree with the previous two replies. This is a perfect design....if you're trying to create a graveyard full of tombstones.
Electronics Forum | Tue Feb 16 13:58:02 EST 2016 | tsvetan
this document http://www.latticesemi.com/view_document?document_id=671 may be good start point but note that how to escape from the BGA is not big deal, how to route your filtering capcitors, grounding, impedance control lof you high speed signals ar
