Electronics Forum | Fri Aug 08 13:31:37 EDT 2008 | RobP
We have a customer that wants us to quote a project placing 12x12 mil dies in large volumes. I can not find feeders for my pick-and-place equipment that will handle wafers with dies that small. Thus, I'm now looking to go to a die sorter to put the
Electronics Forum | Thu Aug 02 21:22:15 EDT 2018 | davef
I need your input. What are your thoughts? Currently SMTnet is looking to improve process. It uses four different lists of categories that all are maintained and updated separately. A single LIST makes sense. Approaches to arranging the LIST being
Electronics Forum | Sat Jun 01 18:00:19 EDT 2002 | stefwitt
I guess we can only speculate about the outcome of this recession. By shifting manufacturing to China, we also transfer technology and know how. If just the market of telecommunication takes off, boards of the latest technology ( flip chip, wafer fe
Electronics Forum | Wed Aug 01 09:36:17 EDT 2001 | Pete Barton
Jay, > > I agree with your assement and Chips on > the Quads. I once worked at a shop that had Quads > and DynaPerts(at the time) The perts were > slower(TIME) and required(EFFORT/PEOPLE) more > MAINTENANCE(more effort more people and more > re
Electronics Forum | Tue Nov 11 09:19:17 EST 2008 | davef
By the way you asked the question, we assume that by "reballing" you mean bumping, we should be able to figure that out: * Volume of the ball = ( pi*d^�)/6 = [355/113] *0.6*0.6*0.6]/6 = 0.11mm^3 * Volume of solder required = 2*volume of ball = 2*0.11
Electronics Forum | Tue Aug 02 15:05:38 EDT 2011 | davef
A couple of points: * Just a nit, 'screens' fell in disuse 10-15 years ago. Old habits die slowly don't they? * Yes, DEK and MPM each hold about 50% of the solder paste printer market and about 4 or 5 others hold the rest. SOLDER PASTE PRINTER EQUI
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