Electronics Forum: waite (Page 46 of 82)

Gold Contacts

Electronics Forum | Fri Mar 23 11:58:01 EST 2001 | mparker

You are mixing long exposed paste back into fresh? How long has your fresh jar been open to the air? You are probably doing yourself a disservice by scavenging the paste (it could have moisture entrapped). Your visocity has definitely changed. You a

Desiccants and pcb finish degradation?

Electronics Forum | Wed May 16 08:48:12 EDT 2001 | ohboy

I been a bunch o' places...! Some good, some bad, re-inventing the wheel in many cases. Our specs are pretty specific in a lot of cases, but that doesn't mean they always get followed. It usually becomes a case of "It's not quite right, but we rea

Sponge Control

Electronics Forum | Fri Jul 20 15:53:57 EDT 2001 | davef

Bowing to jokesters with comments about cake, in-laws that drink all their beer, musician friends, and whatnot; I'll push forward. What do yall do to manage the life and contamination level in the sponges that hand soldering operators use to clean t

selective wave soldering unit

Electronics Forum | Mon Dec 20 08:26:17 EST 1999 | pascal MATHIEU

hello guys ; we are using some standard selective wave soldering unit used in lined ; the drawback of a such machine is 1/the speed which is quiet low (the board is coming on position through the conveyor, then the head delivering the solder moves s

Re: Need advise on regarding Vias

Electronics Forum | Fri Dec 17 12:09:09 EST 1999 | Boca

Outstanding advice gentlemen! To borrow Dave F's line "I'd like to take a bit of a different angle." Ie. a few wave solder specific issues If this assembly is going over wave solder then avoid vias under passive components, it invites solder bal

solder mask wrinkles

Electronics Forum | Tue Oct 19 10:53:14 EDT 1999 | Carol Zhang

Hi, I tried to use high temperature solder (540 - 570F)to connect four spacers on the board. The solder mask around the spacers wrinkled a lot.I can even see a few bulbs around it. I use hot plate and solder rings. After hot plate is heated to appr

Re: reflow/cure/wave for double side assembly

Electronics Forum | Sun Oct 03 21:36:57 EDT 1999 | JAX

| What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | How about curing bottom side first and reflowing top side later? | | What percentage of companies run reflow/cur

Re: Pay scale

Electronics Forum | Mon Oct 04 03:52:26 EDT 1999 | JAX

| | What is the average pay that a SMT Programmer would get? The machines would be Fuji and Universal. | | This is going to open up a can of worms involving phrases relating to monkeys and peanuts. I have come across a spectrum of scales depending on

Re: I looking for a beta site for a new drying process

Electronics Forum | Thu Aug 19 04:49:09 EDT 1999 | Earl Moon

| | | We have developed a new process for removing moisture from surface mount devices. We have one site where PCB laminate drying has been reduced to 1.5 hours. A standard oven took 4 hours to do the job. I am looking for a firm who does large scale

BGA fab: what's reasonable practise for double sided PCB?

Electronics Forum | Thu Jul 15 14:18:24 EDT 1999 | Gord Wait

I'm designing a board where the parts will only fit if I do one of the following: 1. Put BGAs on both sides 2. Put BGAs on top, smt TSOPs directly underneath and using blind vias to keep the real estate on the bottom side below the BGA parts. Can


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