Electronics Forum | Sat Feb 12 09:08:47 EST 2000 | Sal
Experiencing a problem with a 208 PBGA device. I am achieving good wetting with the exception of one ( damn) pin on the outer corner.I have a really good profile but the worrying thing is that it is so inconsistant. Once this open pin failure is dete
Electronics Forum | Mon Jan 29 11:11:29 EST 2001 | Casey Scheu
The solder ball collapse is associated with overheating. Of coarse there's no problem taking it off, your nuking it. The problem, as your aware, is in the replacement. The machine your using is overdriving the process. The key to this repair is in
Electronics Forum | Mon Jul 16 21:44:07 EDT 2001 | davef
You�re correct. If you attach $5 to each board, your customer will be happy to approve your process change. Consider: �Process Improvement Strategies: Implementation Of A No-Clean Process" http://www.smta.org/knowledge/proceedings_abstract.cfm?PRO
Electronics Forum | Wed Sep 29 07:28:04 EDT 1999 | Wolfgang Busko
3�C/min) or maximum temperature (~240-250�C)." For the correct handling of moisture sensitive devices and prebaking advices see IPC-SM-786A or newer publikations. I encountered the following: A tray of sample BGAs was send to me proper packed and se
Electronics Forum | Wed Jul 21 13:12:11 EDT 1999 | John Thorup
| I have pcb's in which i am experiencing warping. | the boards are 12.8125" on a diagonal measurement. | they are out approximatley .010". | the boards are combination thru-hole,smt, they also have 3ounce copper.what is acceptable,and what is the pr
Electronics Forum | Wed Jul 14 11:27:41 EDT 1999 | Michael Zadrejko
I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run it t
Electronics Forum | Tue May 25 09:19:00 EDT 1999 | Ricardo Lopes
| | Has anyone had any experience or data using vibration during the reflow process. | | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process work
Electronics Forum | Mon May 10 15:55:16 EDT 1999 | Paul Wieland
| Can anyone pls enlighten me on the rework of BGA. | I reworking on a optic BGA with a glass plate on it. | Is there any special requirement to take care for the | rework. | | Thank You **************** I don't fully understand you problem but
Electronics Forum | Thu Jan 14 08:32:22 EST 1999 | Jim Nunns
They are supposed to be production parts. Our volumes are in the hundreds due to rapid change though. Jim Nunns | Just a comment: we've seen PBGAs curl up at the corners, but only on prototype components that came off of a low-volume "prototype"
Electronics Forum | Tue Jul 14 15:21:28 EDT 1998 | Brian Conner
| We are wave soldering a board having 24 similar thru hole connectors on it, using a wave soldering pallet. The problem is that one particular pin of connector in around 6-9 connectors get excess solder on the bottom side. I have tried all the par
