Electronics Forum: warp baking (Page 1 of 6)

Land Grid Array soldering

Electronics Forum | Thu Apr 14 09:45:58 EDT 2016 | emeto

Why don't you fix the PCB flatness instead? If that is not the problem, I will check the part warping during the reflow process.If the part is large as you mentioned, it probably warps a lot during reflow. Try to bake the parts in front,based on MSL

Board Warpage

Electronics Forum | Tue Apr 29 02:08:21 EDT 2008 | sin4d

Hi, I am also facing the same probelm. I assembly a substrate with a thickness of 0.30mm and the board warp after reflow. If I bake the substrate at 125 Deg C for 2 hours will it help to solve this problem? Thanks

PCB Warp Issues

Electronics Forum | Fri Jul 16 08:14:15 EDT 2010 | vetteboy86

We're expereincing issues in our pick and place machine due to what I consider a server warping of the PCB. The PCB is received this way from our PCB manufacturer. Before I push to much, I would like to know options for a cause. The warp is so bad,

PCB bows after wave soldering

Electronics Forum | Thu Jul 01 11:48:10 EDT 2010 | mb_mfg

Sid, Try baking the boards before running, to insure no moisture. Baking out the moisture will help prevent warping. Should you need further assistance, we supply fixtures to force the board to stay flat to reduce to thermo shock during wave solde

BGA Repair Problems

Electronics Forum | Wed Aug 12 12:32:56 EDT 1998 | Rich Croteau

Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple p

BGA short

Electronics Forum | Thu Dec 15 09:05:44 EST 2005 | russ

These random shorts, are they most prevailent on the edges, corners, or truly all over the place. It almost sounds like package warp/delamination or something of that nature. Are you baking parts per MSL requirements?

Waffle Tray Handling and Storage

Electronics Forum | Fri Feb 23 08:56:21 EST 2007 | russ

I persoanlly have noticed issue with either method, only time I run into issues with trays is when they get baked at too high of temp and warp. Russ

PoP parts

Electronics Forum | Thu Apr 17 07:51:19 EDT 2014 | emeto

Opens are on the device to the PCB - mainly on the edges, that makes me think I get some kind of warping,but even if I bake parts and boards doesn't help. We also tried different reflow profiles - same results. I hear that some people use dip fluxers

Remove,Re-ball then Re-use BGA safely !!!

Electronics Forum | Tue Jul 16 01:28:48 EDT 2002 | ppcbs

Our BGA Rework process has resulted in 100% yield. We always bake BGA chips at 125 degrees C for at least 8 hours before installation. We always bake loaded boards at 90 degrees C for at least 12 hours before BGA removal. Any parts that went throug


Electronics Forum | Thu Feb 14 07:33:24 EST 2008 | cyber_wolf

Does anyone have any experience with this component ? We seem to have some warping issues through reflow. We have tried everything profile wise....pre bake parts etc.

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