Electronics Forum | Thu Oct 25 04:58:58 EDT 2007 | wayne_
I think the not fully melted BGA ball is the main problem. The middle of the BGA IC...the ball not fully melted....when it subjected to heat and cause PCB warpage....the partial melted joint in the middle part of the BGA started to crack...bcos of we
Electronics Forum | Mon Nov 26 22:05:34 EST 2007 | shy
currently i'm open my stencil aperture is 80% from the land pattern. is this will cause insufficient solder at the terminal component or not? the stencil thichness is 6mil and the board run using SMT pallet which i consider there will be no option f
Electronics Forum | Sat Aug 21 15:02:32 EDT 2010 | jry74
I have a pcb with 750 plated through holes that get Holtite sockets inserted into them. I have a method of pressing in 10 sockets at a time. However, when we are done, the board has bad warpage on the X and Y axis. Does anyone out there have any t
Electronics Forum | Fri Dec 10 01:02:36 EST 2010 | sparrow
Hello, our products are made on single-sided boards and we often have problems with receiving too warped PCBs from our suppliers. Can anybody suggest a good laminate or the most important properties of the material so we could specify it when we orde
Electronics Forum | Tue Dec 23 07:49:10 EST 2014 | robertwillis
the most common reason can be popcorning of the device or warpage of the packages during reflow. the distacnce from the boatom of the device is decreased hence the solder shorts. Trying doing some measurements on the package during simulated reflow.
Electronics Forum | Wed Jan 11 18:59:22 EST 2023 | agrivon
At SMT assembly level, the main HiP mitigation actions to consider should be increasing the stencil thickness/aperture sizes (typically in the 4 corners where warpage is maximal) + possibly reducing the reflow peak temperature as probably indicated i
Electronics Forum | Thu Nov 23 11:01:21 EST 2023 | kojotssss
Perform profiling with a product where the LED is placed more than on another products. You get a valuable case with a higher delta T and possible maximum reflow temperature must use, etc. This profile will be used for similar products. You need to o
Electronics Forum | Mon Jun 14 12:11:54 EDT 1999 | Earl Moon
| We are a medium sized PCB assy. house manufacturing about 2000 motherboards a day. There is a major problem we are facing at the wave soldering stage, i.e. warpage of the PCB. As soon as the PCB touches the wave it warps severely from the centre
Electronics Forum | Tue Jul 20 14:17:34 EDT 1999 | Curtis
| We are a medium sized PCB assy. house manufacturing about 2000 motherboards a day. There is a major problem we are facing at the wave soldering stage, i.e. warpage of the PCB. As soon as the PCB touches the wave it warps severely from the centre
Electronics Forum | Tue Jan 23 10:22:27 EST 2007 | Peter W.
Hello, maybe you are experiencing the so called "head in pillow" defect. It is especially critical for larger BGA. The defect comes from the deformation during reflow of the BGA, so that some of the balls are lifted and have no contact during liquid