Electronics Forum | Wed Sep 08 20:26:30 EDT 1999 | Jackie Hsieh
| | | | | Hello: | | | | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting int
Electronics Forum | Thu Jul 29 12:33:38 EDT 1999 | Wolfgang Busko
| Currently, we are baking any PCB before process on SMT, the 'reason' is to dry any possible humidity that could be inner the PCB, it does not matter if the PCB is multilayer or not. We bake PCB's at 107C for 4 hrs and the board must be process into
Electronics Forum | Sun May 16 10:11:50 EDT 1999 | M Cox
| I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. | | I do
Electronics Forum | Thu May 20 11:51:37 EDT 1999 | KT
| I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. | | I do
Electronics Forum | Thu Feb 25 22:01:52 EST 1999 | Chris G.
| Read an earlier thread about using glass slugs to determine placement CPk. Can it actually be done this way? What's the procedure? Be interesting to know 'cause if it's feasible, I'd probably get myself a kit. None of us here are stat's experts
Electronics Forum | Wed Aug 19 12:20:24 EDT 1998 | MARK J.
| Hi there, | I'm actually facing a lot of trouble with PCB's presenting up to 3mm of bow /twist at reception i.e. before assembly. The PCB size is 220 by 230mm. The boards are to be assembeled SMD double sides with 05.mm pitch on both sides. In orde
Electronics Forum | Wed Jun 03 09:04:19 EDT 1998 | Steve Gregory
Hi Anthony! Earl's right, things can get rather involved when you start discussing ALL the things that affect whether or not a board is going to warp. The way I look at the issue is try to separate the warp issue into two catagories; 1. The board bei
Electronics Forum | Tue Apr 07 15:55:37 EDT 1998 | Michael Allen
| I'm also in the "Don't score it" camp. Routed breakaways are much better. If your wave solder process has decent control on the wave height, you shouldn't worry about flooding the boards. | The fine pitch consideration for panelizing - Since you
Electronics Forum | Wed Sep 19 09:34:08 EDT 2001 | jschake
Both FormFlex and Grid-lok tooling systems are marketed as compliant tooling systems. Both are able to conform to the variations of the topography on the bottomside of a substrate to provide full support during printing of 2nd side assembly. The ba
Electronics Forum | Wed Jan 16 15:22:29 EST 2002 | Terry Burnette
In his book titled "Manufacturing Techniques for Surface Mount Assemblies" author R.J. Klein Wassink describes the relationship between solder land dimensions, component lead coplanarity, board warpage, solder volumes, and solder paste flux wetting b
