Electronics Forum: wash (Page 116 of 161)

Tarnish Occuring after Washing???

Electronics Forum | Sun Jul 24 16:10:16 EDT 2011 | davef

As a shot in the dark response to a hopelessly vague question .... Back in the old days, we'd see corrosion of metal parts after DI water washing when our water was on the high-end of the resistivity range, usually after we received fresh tanks from

Re: help help! Water clean for CSP/BGA package

Electronics Forum | Tue Oct 05 04:01:36 EDT 1999 | Brian

| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl

Re: Radial capacitors have water gain

Electronics Forum | Mon May 10 13:35:14 EDT 1999 | Chrys Shea

| We have been having an ongoing problems with radial electrolytic capacitors (thru hole)for some time. | 1. When we wash them in our inline cleaners the sleeving shrinks up from the PCB leaving the 'can' exposed. Some designs have traces on the

Re: Radial capacitors have water gain

Electronics Forum | Mon May 10 14:44:15 EDT 1999 | C.K.

| | We have been having an ongoing problems with radial electrolytic capacitors (thru hole)for some time. | | 1. When we wash them in our inline cleaners the sleeving shrinks up from the PCB leaving the 'can' exposed. Some designs have traces on

Re: Drying ICs any advice

Electronics Forum | Fri May 15 17:31:04 EDT 1998 | Steve Abrahamson

| | | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin

Re: Solder FINES vs. Solder Balls

Electronics Forum | Sat Apr 17 12:00:12 EDT 1999 | John W

| | | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | | | I consider "fines" individual unmelted metal spheres t

Re: Solder FINES vs. Solder Balls

Electronics Forum | Sun Apr 18 00:26:29 EDT 1999 | Vic Lau

| | | | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | | | | | I consider "fines" individual unmelted metal sph

Re: water soluble mask

Electronics Forum | Mon Sep 27 08:52:11 EDT 1999 | Brian

| i had a problem here, during the wave soldering process, we apply a water soluble mask on the gold finger to protect it from contamination. But after washing, there is still some mask left on the gold finger. | Can anyone pls advise is there any pa

Re: Cleaning procedures for Entek-Plus Cu-106A

Electronics Forum | Tue Apr 20 17:56:42 EDT 1999 | Chrys Shea

| | I am wondering if anyone has any info regarding solder paste misprint clean-up procedures for Entek Plus CU-106A PCB's utilizing a water-clean solder paste. In a implementation procedure they recommend a 2-3 minute wash cycle with the following

Re: White layer appearance on PCB

Electronics Forum | Thu Jan 28 16:29:03 EST 1999 | Tom B

Okay, Another question, if the soldermask in not cured, then it is washed will water ingress (from wash or ambient ) play havoc with capacitance or dielectric of PCB. I mean will my crystal and clock circuits start "Y2K'n" on me. OR will my PCB go


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