Electronics Forum: water wash (Page 1 of 77)

boards damaged by water wash

Electronics Forum | Tue Apr 06 12:55:01 EDT 1999 | Patrick O'Connor

0603's and 0402's are being damaged by the water wash post reflow. PCA's are 1" X 4" and 2" X 2" approximately. We've adjusted water pressure so that the top-down is higher than the bottom up. The baskets have a .5" mesh spacing. Some baskets h

Baking assemblies after ultrasonic water wash

Electronics Forum | Fri Jun 26 00:28:43 EDT 2009 | Mark

IPA is hydroscopic.

Baking assemblies after ultrasonic water wash

Electronics Forum | Tue Jun 30 13:20:10 EDT 2009 | charliedci

He wants to "see underwater"

water wash small but mechanically sensitive PCBA

Electronics Forum | Wed Jun 24 21:34:02 EDT 2015 | kennyg

I am struggling with a water wash process for a very small (1"x1") PCB. It has components that are very esily damaged by contact. I'm stuck with wash. I know, I know, but no-clean isn't an option. We put the board in s compartmentalized wash basked

Baking assemblies after ultrasonic water wash

Electronics Forum | Thu Jun 25 20:01:54 EDT 2009 | davef

Shanelo Technologies Given that isopropyl alcohol [IPA] is produced by combining water and propene. How does soaking a board in water and a flammable liquid drive off water?

Baking assemblies after ultrasonic water wash

Electronics Forum | Wed Jun 24 05:08:37 EDT 2009 | Mark

Try immersing the assembly in IPA for 30 minutes. IPA is hydroscopic ans will drive off most of the water. Dry the assembly. Then bake at 110°C for 2 hours.

Baking assemblies after ultrasonic water wash

Electronics Forum | Thu Jun 11 22:57:45 EDT 2009 | davef

NASA recommends baking a PCB for a minimum of 4 hours at 93+/- 5.5�C before conformally coating. [NASA-STD-8739.1, �Workmanship Standard for Staking and Conformal Coating of Printed Wiring Boards and Electronic Assemblies,� August 6, 1999]

Baking assemblies after ultrasonic water wash

Electronics Forum | Wed Jul 01 05:26:31 EDT 2009 | kpm135

But the boards and parts on the boards are also hygroscopic(no not a typo I did a search on hydroscopic and it is not a word the actual word is hygroscopic look it up if you don't believe me) so if you have two hygroscopic materials which one wins?

Re: boards damaged by water wash

Electronics Forum | Tue Apr 06 16:22:58 EDT 1999 | Dave F

| 0603's and 0402's are being damaged by the water wash post reflow. PCA's are 1" X 4" and 2" X 2" approximately. | | We've adjusted water pressure so that the top-down is higher than the bottom up. | | The baskets have a .5" mesh spacing. Some

Baking assemblies after ultrasonic water wash

Electronics Forum | Tue Jun 09 18:44:20 EDT 2009 | dyoungquist

We are using a water soluble flux which requires the assemblies to be cleaned in an ultra sonic cleaner after assembly. Is there a standard that specifies how long the assemblies need to be baked/dried after being submersed in a water solution for a

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