Electronics Forum | Tue Nov 13 21:59:42 EST 2007 | davef
This processes has the potential to cause barrel cracking and pad lifting, because the heating is very hot [troop crank-up the volume on their iron when they see thick boards] for a relatively small area on one side of the board. What do we suggest
Electronics Forum | Tue Nov 14 18:38:59 EST 2006 | Brandon
Hello all, I am having an issue with some boards on our Wave Solder. It is a Pb free wave and These particular boards are exibiting A LOT of what I call solder bubbles in the larger than usual vias and un-used thru holes. Settings: 4 inch/min 144c to
Electronics Forum | Mon Apr 21 11:55:29 EDT 2008 | realchunks
"Disturbed" usually means some form of movement. I would think your leads are moving due to warp as the board exits the reflow zone. Not knowing your profile, I would suggest checking your profile. Make sure you have adequate "above liquidous" and
Electronics Forum | Tue Oct 18 00:31:17 EDT 2005 | KEN
I suspect the problem is a surfactant issue in your flux. I have seen where boards are fluxed, hit the solder fountain and come out like they never touched the solder. There was an inadequate surfactant between the solder and the PCB. I know you
Electronics Forum | Fri Apr 03 08:34:54 EDT 2020 | SMTA-Gregory
We need to be careful with product to avoid introducing a new failure mode, namely corrosion and dendrite growth, especially those running no clean processes! In addition to heat (reflow, wave and some selective soldering processes) killing the vi
Electronics Forum | Fri Oct 14 09:21:36 EDT 2005 | lupo
According with temperature vs. wetting force diagram 245-250C/degrees is better, so lower temperature than 500F means better solder fill. If the speed is too lower the solder suck out form the hole. Usually 120-150cm/min. is good. (2-4s contact
Electronics Forum | Thu Jun 24 04:38:31 EDT 1999 | Vinesh Gandhi
Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody help
Electronics Forum | Thu Jan 21 19:38:24 EST 1999 | dean
| Hello, | | I will be evaluating and qualifying two equipment types. The first is a fountain soldering device. I need practical advice on all the stuff you guys and gals know about as good, bad, ugly, best applications, setup, limitations, and all
Electronics Forum | Thu Jan 21 20:22:02 EST 1999 | Earl Moon
| | Hello, | | | | I will be evaluating and qualifying two equipment types. The first is a fountain soldering device. I need practical advice on all the stuff you guys and gals know about as good, bad, ugly, best applications, setup, limitations, an
Electronics Forum | Wed Jun 30 11:38:05 EDT 1999 | Brian Conner
| We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). Ins
