Electronics Forum | Mon Nov 20 21:02:46 EST 2000 | Michael Psrker
First question I have for you is: Are you assuming that standard precautions are in place at your facility to minimize moisture content i.e. air- deionizers, vacuum sealed packaging, humidity control in storage and manufacturing? You do not mention
Electronics Forum | Thu Jul 06 13:29:42 EDT 2006 | Chunks
Unfortunately it's not what you know, but who you know. Sounds like it in your case. Tread lightly as this guy may become your boss. It happened to me. New guy comes in, couldn't tell the "red stuff" from the "gray stuff" (adhesive / paste in cas
Electronics Forum | Tue Feb 15 14:35:41 EST 2000 | Balas
hi I am designing a test vehicle with a range of components on it(pbga, cbga,fc, mbga, and qfps). My concern is that I would like to use a single stencil for solder deposition and not a stepped stencil. That would require me to have aperture design a
Electronics Forum | Fri Oct 01 14:16:15 EDT 1999 | Rick
I know there are a ton of variables that affect the overall height of a BGA after soldering to a PWB but... I'd like to know if anyone has done an analysis of (or if it's documented) as to what the pre and post reflow height dimension as measured fr
Electronics Forum | Fri Jan 08 15:02:38 EST 1999 | Dave F
| HI! I am a package engineer in Korea. I have some reasons | to desolder excessive solder at the lead of TSOP and TSOJ | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. | Does anyone
Electronics Forum | Wed Feb 25 09:40:31 EST 1998 | Doug Romm
Steve, TI does not produce any SOTs using Palladium finish leadframes. I would certainly be interested to know who is. Also, your observations are correct: In TI experience the mechanical strength of the solder joints with Pd finish ICs is alw
Electronics Forum | Wed Jan 09 14:52:53 EST 2002 | Chris
Hi, I have read many articles about theromsonically bonding to soft gold. Many of these articles state you can bond to 10uinches of gold. I have worked with both Hughes and Panasonic bonders at two different companies and I have never been able to
Electronics Forum | Fri Jan 27 17:23:10 EST 2006 | muse95
Watch the solder profiles allowed for these caps. Most electrolytics cannot withstand high heat. Even RoHS compliant Electrolytics are often rated for peak 245C, 3 secs max, for example. Nowhere close to the 260C 10-20 sec you usually like to see.
Electronics Forum | Tue Jun 19 12:26:38 EDT 2007 | billr73
We will be hand soldering a small number of PCBs per week (both through hole and SMT) using a water soluble flux. We will be using both standard leaded and lead free solder. The completed assemblies be hand washed in a sink using hot water. Do we
Electronics Forum | Wed Sep 24 04:18:12 EDT 2008 | gang
we have some problems in soldering joints such as insufficient solder and misalignment on some RC0402 and CC0402,i don't have a pic here. our SMT enginner doubts the PCB land pattern is at the fault.here is what we measured results.pad length:0.9mm,
