Electronics Forum: wave and solder (Page 231 of 569)

cap size and copper thickness vs part size questions

Electronics Forum | Tue Nov 08 05:00:23 EST 2005 | rlackey

Hi CW, Regarding orientation, yes, your diagram is right - see the following link for confirmation. http://search.murata.co.jp/Ceramy/image/img/A18X/C2EB3C.PDF Regarding information on bending strength you want to talk to your local Murata office

Suggestions for small and handy connector for in-circuit program

Electronics Forum | Mon Oct 24 05:43:52 EDT 2016 | zxcvb

I have many PCBs that use an AVR in SMD packaging, and since I frequently change the firmware in prototype boards, I'm trying to come with the best solution to program the AVR quickly and easily. The first approach was to have a standard header (2x5

Line release of post reflow AOI and AXI

Electronics Forum | Tue Sep 16 19:16:11 EDT 2008 | hegemon

Hello everyone! > > I'm a student of electrical > engineering currently working on a thesis for my > BSc degree. It will be about post reflow AOIs and > AXIs, and I'd kindly like to ask you for some > help with it. > > I would like to know if t

Re: Adhesive Dispenser Vs. Screen Printing Adhesives Pros and Cons

Electronics Forum | Thu Oct 12 22:16:59 EDT 2000 | Dreamsniper

Hi Guys, I'd like to share this to all of you...you can start playing with the rests...Stated prices, if not indicated, are in Aussie $ or Singapore $. Stencil Printing Adhesive Pros a) Less Capital Equipment Cost (Short Term). In reality it is f

Re: Convection Oven and thermo profiling of Circuit Boards

Electronics Forum | Wed Apr 19 14:07:20 EDT 2000 | Russ Cutler

Let me see if I've got this straight...rather than hook up a MOLE or a KIC profiler to each and every board (600 P/N's in my case), most people are making judgement calls based solely on how similar a board looks to another board, for which they have

environment Operational deg-C and RH% for Paste Printer

Electronics Forum | Thu Jun 06 02:27:43 EDT 2002 | ianchan

Hi mates, does anyone know if there is a industrial standard spec for environment(deg-C, RH%) operational use of Paste Printer machines? If there is no study to define a deg-C, RH% specs for immediate environemnt operation use of a paste printer ma

Recommended TG material for CCBGA , CBGA and PBGA's

Electronics Forum | Mon Mar 03 13:22:20 EST 2003 | MA/NY DDave

Hi I see David F already gave a good answer. The basic advantage, if you can afford it, is a more stable PCB during the soldering process. Higher Tg enables this. Also some materials serve to match CTEs (coefficient of thermal expansion) a bit bett

About use of water washable pastes and fluxes

Electronics Forum | Wed Jan 05 08:58:13 EST 2005 | davef

Q1. Is it enough to use only water while cleaning or is it necessary to use any additional chemistries and/or saponifiers as well? A1. It depends on: * Flux residues that you're cleaning * Standoff of the components * Cleaning technology [we've neve

cost analysis: Manual vs. Auto insertion pick and place

Electronics Forum | Fri Aug 04 13:47:20 EDT 2006 | pemea1

apples to apples. 20 boards 80 parts top and 10 parts bottom. these boards are done on a semi regular basis (you know the boards are coming to you from an OEM at least three times a month, just no exact schedule). All that is required is pasting..mo

Advice Needed between a DEK 265GSX and a MPM UP3030!

Electronics Forum | Mon Oct 09 14:30:44 EDT 2006 | Brian

I agree with Chunks. Programming was much simpler. The 2D inspection is much better on MPM. I didn't have to use offsets on the MPM or the DEK very often, but did more on teh DEK. I didn't like the front justified stencils on the DEK. I also did


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